Patent Assignment
Reel/Frame 012547/0523
Assignment of Assignor's Interest
Recorded: 2002-01-31
Pages: 3
Assignors
KATO, YOSHIHARU
Executed: 2001-12-28
KAWAMOTO, SATORU
Executed: 2001-12-28
TANIGUCHI, FUMIHIKO
Executed: 2001-12-28
HIRAOKA, TETSUYA
Executed: 2001-12-28
TAKASHIMA, AKIRA
Executed: 2001-12-28
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
Covered Property
(1)
Multi Chip Package Structure Having a Plurality of Semiconductor Chips Mounted in the Same Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 5, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0876 →
Change of Name
Aug 2, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024804/0269 →
Assignment of Assignor's Interest
Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035507/0851 →