Patent Assignment
Reel/Frame 012579/0230
Assignment of Assignor's Interest
Recorded: 2001-07-10
Received: 2002-02-20
Pages: 3
Assignors
ISHITSUKA, NORIO
Executed: 2001-04-06
OKAMOTO, KEIJI
Executed: 2001-04-06
SHIMODA, MAKI
Executed: 2001-04-06
SUZUKI, NORIO
Executed: 2001-04-06
WATANABE, KOZO
Executed: 2001-04-06
YOSHIDA, YASUKO
Executed: 2001-04-06
TAKAMATSU, AKIRA
Executed: 2001-04-09
IKEDA, SHUJI
Executed: 2001-04-10
HORIBE, SHINICHI
Executed: 2001-04-13
ICHIZOE, HIROYUKI
Executed: 2001-04-17
OGISHIMA, ATSUSHI
Executed: 2001-04-20
KOJIMA, MASAYUKI
Executed: 2001-04-23
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JPX, JAPAN
HITACHI ULSI SYSTEMS CO., LTD.
22-1, JOSUIHONCHO 5-CHOME, KODAIRA-SHI, TOKYO, JPX, JAPAN
Covered Property
(1)
Semiconductor Integrated Circuit Device and Method of Manufacturing Involving the Scale-Down Width of Shallow Groove Isolation Using Round Processing
Application:
09/889,018 →