IP Library Granted Patent US 6,562,695
Granted Patent Utility PCT National Stage
US 6,562,695 · Confirmation No. 4518

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING INVOLVING THE SCALE-DOWN WIDTH OF SHALLOW GROOVE ISOLATION USING ROUND PROCESSING

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Code Description Pages PDF
2001-07-10 ABST Abstract 1 View
2001-07-10 LET. Miscellaneous Incoming Letter 116 View
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Quick Facts
Patent No.
US 6,562,695
App. No.
09/889,018
Filed
2001-07-10
Granted
2003-05-13
Art Unit
2824
PTA
0 days