Patent Assignment
Reel/Frame 012587/0315
Assignment of Assignor's Interest
Recorded: 2002-02-15
Pages: 2
Assignor
TAGO, MASAMOTO
Executed: 2001-01-31
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Compact Semiconductor Device Capable of Mounting a Plurality of Semiconductor Chips with High Density and Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.