IP Library › Assignment 012662/0068
Patent Assignment
Reel/Frame 012662/0068

Assignment of Assignor's Interest

Recorded: 2002-02-27 Pages: 3
Assignor
NOGAWA, JUN
Executed: 2002-02-21
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Wire Bonding Device
Patent: 6,669,076 →
Application: 10/086,040 →
Publication: US 2002/0104870
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 19, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013740/0570 →
Change of Name Dec 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025486/0530 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →