IP Library › Assignment 012662/0154
Patent Assignment
Reel/Frame 012662/0154

Assignment of Assignor's Interest

Recorded: 2002-03-04 Pages: 3
Assignor
LEE, KYO-YEOL
Executed: 2002-03-04
Assignee
SAMSUNG CORNING CO., LTD.
472 SHIN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Method for Fabricating Group Iii-V Compound Semiconductor Substrate
Patent: 6,933,213 →
Application: 10/086,892 →
Publication: US 2002/0123157
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Mar 10, 2008
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING CO., LTD.
Reel/Frame 020624/0240 →
Corrective Assignment to Correct the Assignee/Assignor Previously Recorded on Reel 020624 Frame 0240. Assignor(S) Hereby Confirms the Merger. May 16, 2008
From: SAMSUNG CORNING CO., LTD.
To: SAMSUNG CORNING PRECISION GLASS CO., LTD.
Reel/Frame 020956/0832 →
Change of Name Aug 6, 2010
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 024804/0238 →
Change of Name Jan 16, 2015
From: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
To: CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 034774/0676 →