Patent Assignment
Reel/Frame 012670/0806
Assignment of Assignor's Interest
Recorded: 2002-03-12
Received: 2002-03-18
Pages: 3
Assignors
TAGO, MASAMOTO
Executed: 2001-12-27
TAKAHASHI, KENJI
Executed: 2001-12-27
TOMITA, YOSHIHIRO
Executed: 2001-12-27
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Semiconductor Device with a Binary Alloy Bonding Layer
Application:
09/969,657 →