IP Library › Granted Patent US 6,583,514
Granted Patent Utility
US 6,583,514 · Confirmation No. 9344

SEMICONDUCTOR DEVICE WITH A BINARY ALLOY BONDING LAYER

Patented Case View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-10-04 TRNA Transmittal of New Application 2 View
2001-10-04 ADS Application Data Sheet 2 View
2001-10-04 SPEC Specification 15 View
2001-10-04 CLM Claims 5 View
2001-10-04 ABST Abstract 1 View
2001-10-04 DRW Drawings-only black and white line drawings 7 View
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Quick Facts
Patent No.
US 6,583,514
App. No.
09/969,657
Filed
2001-10-04
Granted
2003-06-24
Pub. No.
US20020090756A1
Art Unit
2822
PTA
-166 days