Patent Assignment
Reel/Frame 032613/0379
Change of Name
Recorded: 2014-04-07
Pages: 5
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-13
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Semiconductor Device with a Binary Alloy Bonding Layer
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignees Previously Recorded on Reel 012670 Frame 0806. Assignor(S) Hereby Confirms the Assignees.
Mar 27, 2014
From: TAGO, MASAMOTO; TOMITA, YOSHIHIRO; TAKAHASHI, KENJI
To: NEC CORPORATION; MITSUBISHI DENKI KABUSHIKI KAISHA; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 032537/0677 →
Merger
Mar 31, 2014
From: RENESAS TECHNOLOGY CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 032568/0589 →
Assignment of Assignor's Interest
Apr 22, 2014
From: NEC CORPORATION; RENESAS ELECTRONICS CORPORATION; KABUSHIKI KAISHA TOSHIBA
To: RENESAS ELECTRONICS CORPORATION; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 032724/0541 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Split and General Succession
Aug 20, 2019
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 050095/0076 →
Change of Name and Address
Aug 20, 2019
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 050095/0097 →
Merger
Aug 20, 2019
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 050095/0092 →
Change of Name and Address
Apr 20, 2020
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 052436/0702 →