Patent Assignment
Reel/Frame 016513/0740
Assignment of Assignor's Interest
Recorded: 2005-07-13
Received: 2005-07-13
Pages: 2
Assignor
MITSUBISHI DENKI KABUSHIKI KAISHA
Executed: 2005-06-10
Assignee
RENESAS TECHNOLOGY CORP.
2-4-1, MARUNOUCHI, CHIYODA-KU, TOKYO 100-6334, JPX, JAPAN
Covered Property
(1)
Semiconductor Device with a Binary Alloy Bonding Layer
Application:
09/969,657 →