IP Library › Assignment 012677/0573
Patent Assignment
Reel/Frame 012677/0573

Assignment of Assignor's Interest

Recorded: 2002-03-06 Pages: 3
Assignors
THOMAS, DANIELLE A.
Executed: 2002-01-31
SIEGEL, HARRY MICHAEL
Executed: 2002-01-31
DO BENTO VIEIRA, ANTONIO A.
Executed: 2002-01-31
CHIU, ANTHONY M.
Executed: 2002-01-31
Assignee
STMICROELECTRONICS, INC.
1310 ELECTRONICS DRIVE, CARROLLTON, TEXAS, 75006
Covered Property (1)
Method for Providing a Redistribution Metal Layer in an Integrated Circuit
Patent: 7,096,581 →
Application: 10/091,743 →
Publication: US 2003/0167632
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 13, 2021
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 057791/0514 →
Assignment of Assignor's Interest Oct 25, 2021
From: STMICROELECTRONICS INTERNATIONAL N.V.
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 058298/0235 →