Patent Assignment
Reel/Frame 012689/0389
Assignment of Assignor's Interest
Recorded: 2002-03-02
Received: 2002-03-21
Pages: 2
Assignee
NIKKO MATERIALS COMPANY, LIMITED
10-1, TORANOMON 2-CHOME, MINATO-KU, TOKYO 105-8407, JPX, JAPAN
Covered Properties
(2)
Copper Electroplating Liquid, Pretreatment Liquid for Copper Electroplating and Method of Copper Electroplating
Application:
09/980,947 →
Generation of Variable Differential Group Delay
Application:
09/975,830 →