Granted Patent
Utility
PCT National Stage
US 6,562,222
· Confirmation No. 1702
COPPER ELECTROPLATING LIQUID, PRETREATMENT LIQUID FOR COPPER ELECTROPLATING AND METHOD OF COPPER ELECTROPLATING
Patented Case
View Patent ↗
Inventors
Jyunnosuke Sekiguchi
Ibaraki, JAPAN
Syunichiro Yamaguchi
Ibaraki, JAPAN
Attorneys & Agents of Record
Classification
USPC
205/296
C25D3/38
C25D7/123
H10P14/47
C25D5/34
Prosecution
- Examiner
- WONG, EDNA
- Art Unit
- 1753
- Customer No.
- 270
- Docket No.
- KIN55USA
- Confirmation No.
- 1702
Foreign Priority
2000-11620
·
2000-01-20
·
JAPAN
2000-42158
·
2000-02-21
·
JAPAN
Patent Term Adjustment
0days
CHANGE OF ADDRESS
Recorded 2017-02-07
CHANGE OF NAME/MERGER
Recorded 2011-06-09
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2002-03-02
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Quick Facts
- Patent No.
- US 6,562,222
- App. No.
- 09/980,947
- Filed
- 2001-12-05
- Granted
- 2003-05-13
- Examiner
- WONG, EDNA
- Art Unit
- 1753
- PTA
- 0 days
External Links