Change of Name

Recorded: 2006-11-17 Received: 2006-11-17 Pages: 13

Assignor

NIKKO MATERIALS CO., LTD.

Executed: 2006-04-03

Assignee

NIPPON MINING & METALS CO., LTD.

10-1 TORANOMON 2-CHOME, MINATO-KU, TOKYO, JPX, 105-0001, JAPAN

Covered Properties (6)

Silicide Target for Depositing Less Embrittling Gate Oxide and Method of Manufacturing Silicide Target

Application: 09/980,946 →

Copper Electroplating Liquid, Pretreatment Liquid for Copper Electroplating and Method of Copper Electroplating

Application: 09/980,947 →

Tungsten Target for Sputtering and Method for Preparing Thereof

Application: 09/980,932 →

Ni-Fe Alloy Sputtering Target for Forming Magnetic Thin Films, Magnetic Thin Film, and Method of Manufacturing the Ni-Fe Alloy Sputtering Target

Application: 09/871,284 →

Cathode Material for a Lithium Secondary Battery and Method for Manufacturing Same

Application: 09/828,734 →

Sputtering Target

Application: 09/763,248 →