Patent Assignment
Reel/Frame 041649/0733
Change of Address
Recorded: 2017-02-07
Pages: 20
Assignor
JX NIPPON MINING & METALS CORPORATION
Executed: 2016-01-04
Assignee
JX NIPPON MINING & METALS CORPORATION
1-2, OTEMACHI 1-CHOME, CHIYODA-KU,, TOKYO,, JAPAN
Covered Properties
(312)
Sputtering Target and Method for Manufacturing Thereof
Patent:
6,153,315 →
Application:
09/060,209 →
High-Purity Copper Sputtering Targets and Thin Films
Patent:
6,451,135 →
Application:
09/081,684 →
Method of Manfacturing Member for Thin-Film Formation Apparatus and the Member for the Apparatus
Patent:
6,045,665 →
Application:
09/085,133 →
Method for Eluting Antimony Adsorbed on Chelating Resin
Patent:
5,989,430 →
Application:
09/107,327 →
Mn Alloy Materials for Magnetic Materials, Mn Alloy Sputtering Targets, and Magnetic Thin Films
Patent:
6,270,593 →
Application:
09/123,294 →
BAXSR1-XTIO3-Y Target Materials for Sputtering
Patent:
6,245,203 →
Application:
09/162,661 →
Ni-Fe Alloy Sputtering Target for Forming Magnetic Thin Films, Magnetic Thin Film, and Method of Manufacturing the Ni-Fe Alloy Sputtering Target
Patent:
6,267,827 →
Application:
09/266,259 →
Method of Pretreating Fluid for Electroless Nickel Plating
Patent:
6,156,218 →
Application:
09/355,651 →
Rolled Copper Foil for Flexible Printed Circuit and Method of Manufacturing the Same
Patent:
6,372,061 →
Application:
09/431,910 →
Mixed Powder for Powder Metallurgy, Sintered Compact of Powder Metallurgy, and Methods for the Manufacturing Thereof
Patent:
6,132,487 →
Application:
09/437,913 →
Method of Manufacturing Member for Thin-Film Formation Apparatus and the Member for the Apparatus
Patent:
6,319,419 →
Application:
09/439,139 →
Copper Foil Having Glossy Surface with Excellent Oxidation Resistance and Method of Manufacturing the Same
Patent:
6,319,621 →
Application:
09/451,317 →
Sputtering Target Free of Surface-Deformed Layers
Patent:
6,284,111 →
Application:
09/459,805 →
Cdte Crystal or Cdznte Crystal and Method for Preparing the Same
Patent:
6,299,680 →
Application:
09/462,268 →
Rolled Copper Foil For Flexible Printed Circuit And Method of Manufacturing The Same
Patent:
6,197,433 →
Application:
09/481,673 →
Plated Material for Connectors
Patent:
6,403,234 →
Application:
09/593,416 →
Optical Transparent Film and Sputtering Target for Forming Optical Transparent Film
Patent:
6,528,442 →
Application:
09/719,018 →
Process for Producing High-Purity Mn Materials
Process for Producing Compound Semiconductor Single Crystal
Sputtering Target
Patent:
6,464,847 →
Application:
09/763,248 →
Method of Operating a Copper Smelting Furnace
Cathode Material for a Lithium Secondary Battery and Method for Manufacturing Same
Crystal Growing Device and Method of Manufacturing Single Crystal
Patent:
6,562,134 →
Application:
09/868,087 →
Ni-Fe Alloy Sputtering Target for Forming Magnetic Thin Films, Magnetic Thin Film, and Method of Manufacturing the Ni-Fe Alloy Sputtering Target
Photoelectric Conversion Functional Element and Production Method Thereof
Patent:
6,791,257 →
Application:
09/890,774 →
Monocarboxylate Salts of Imidazole Reaction Products, Process for Preparing the Salts, and Surface Treatments, Additives for Resins, and Resin Compositions, Containing the Same
Tungsten Target for Sputtering and Method for Preparing Thereof
Patent:
6,582,535 →
Application:
09/980,932 →
Silicide Target for Depositing Less Embrittling Gate Oxide and Method of Manufacturing Silicide Target
Copper Electroplating Liquid, Pretreatment Liquid for Copper Electroplating and Method of Copper Electroplating
Patent:
6,562,222 →
Application:
09/980,947 →
Metal Surface Treatment Agent, and Metal Material Coated with Same
Sputtering Target, Transparent Conductive Oxide, and Process for Producing the Sputtering Target
Patent:
6,669,830 →
Application:
10/089,378 →
Titanium Target for Sputtering
Patent:
6,755,948 →
Application:
10/089,626 →
Oxide Sintered Body and Manufacturing Method Thereof
Patent:
6,843,975 →
Application:
10/130,238 →
Method of Producing a Higher-Purity Metal
Adhesion Accelerator for Bonding Rubber to Metal and Rubber Composition
Manufacturing Method of Ito Powder with Tin Dissolved in Indium Oxide, and Manufacturing Method of Ito Target
Water-Based Metal Surface Treatment Agent
Pretreating Agent for Metal Plating
Product Management System, and Host Computer and Recorded Medium Used in the System
High Purity Zirconium or Hafnium, Sputtering Target Comprising the High Purity Zirconium of Hafnium and Thin Film Formed Using the Target, and Method for Producing High Purity Zirconium or Hafnium and Method for Producing Powder of High Purity Zirconium or Hafnium
Copper Alloy Foil
Diffusion-Joined Target Assemly of High-Purity Cobalt Target and Copper Alloy Backing Plate and Production Method Therefor
Patent:
6,793,124 →
Application:
10/239,556 →
Sputtering Target Producing Few Particles, Backing Plate or Sputtering Apparatus and Sputtering Method Producing Few Particles
Sputtering Target Producing Few Particles
Tantalum or Tungsten Target-Copper Alloy Backing Plate Assembly and Production Method Therefor
Hafnium Silicide Target for Gate Oxide Film Formation and Its Production Method
Electrolytic Copper Plating Method, Phosphorous Copper Anode for Electrolytic Plating Method, and Semiconductor Wafer Having Low Particle Adhesion Plated with Said Method and Anode
Surface Treatment for Copper Foil
''A Ii-Vi Compound Seminconductor Crystal
MOSI2 Arc-Shaped Heater, and Method and Device for Manufacturing the Heater
Basic Silane Coupling Agent Organic Carboxylate Composition, Method for Producing the Same, and Epoxy Resin Composition Containing the Same
Organic Carboxylic Acid Salt Composition, Process for Preparation Thereof and Additives for Epoxy Resins
Method for Producing High Purity Nickle, High Purity Nickle, Sputtering Target Comprising the High Purity Nickel, and Thin Film Formed by Using Said Spattering Target
Chamfered Semiconductor Wafer and Method of Manufacturing the Same
Electroless Plating Method and Semiconductor Wafer on Which Metal Plating Layer Is Formed
Manganese Alloy Sputtering Target and Method for Producing the Same
Electrolytic Copper Plating Method, Phosphorus-Containing Anode for Electrolytic Copper Plating, and Semiconductor Wafer Plated Using Them and Having Few Particles Adhering to It
Copper Electrolytic Solution Containing Amine Compound Having Specific Skeleton and Organosulfur Compound as Additives, and Electrolytic Copper Foil Produced Using the Same
Hafnium Silicide Target for Forming Gate Oxide Film and Method for Preparation Thereof
Copper Electrolytic Solution Containing Organic Sulfur Compound and Quaternary Amine Compound of Specified Skeleton as Additives and Electrolytic Copper Foil Produced Therewith
Solid Silane Coupling Agent Composition, Process for Producing the Same, and Resin Composition Containing the Same
Metal Plating Method and Pretreatment Agent
Sputtering Target and Transparent Conductive Film
Copper Electroplating Method, Pure Copper Anode for Copper Electroplating, and Semiconductor Wafer Plated Thereby with Little Particle Adhesion
Surface Treated Copper Film
Hafnium Silicide Target and Manufacturing Method for Preparation Thereof
Process for Producing Single Crystal of Compound Semiconductor and Crystal Growing Apparatus
Method for Connecting Magnetic Substance Target to Backing Plate, and Magnetic Substance Target
Target of High-Purity Nickel or Nickel Alloy and Its Producing Method
Production Method for Compound Semiconductor Single Crystal
Sputtering Target Containing Zinc Sulfide as Major Component, Optical Recording Medium on Which Phase Change Optical Disk Protective Film Containing Zinc Sulfide as Major Component Is Formed by Using the Target, and Method for Manufacturing the Sputtering Target
Sputtering Target for Phase-Change Memory, Film for Phase Change Memory Formed by Using the Target, and Method for Producing the Target
Cdte Single Crystal and Cdte Polycrystal, and Method for Preparation Thereof
Sputtering Target Transport Box
Lithium-Containing Complex Oxide and Method of Producing Same
Metal Powder for Powder Metallurgy and Iron-Based Sintered Compact
Tantalum Sputtering Target and Method for Preparation Thereof
Vapor-Phase Epitaxial Apparatus and Vapor Phase Epitaxial Method
Vapor-Phase Growth Apparatus
Electroconductive Oxide Sintered Compact, Sputtering Target Comprising the Sintered Compact and Methods for Producing Them
High Purity Copper Sulfate and Method for Production Thereof
Iron-Based Sintered Compact and Method for Production Thereof
Iron Silicide Powder and Method for Production Thereof
Iron Silicide Sputtering Target and Method for Production Thereof
Copper Alloy Sputtering Target and Semiconductor Element Wiring
Copper Electrolytic Solution and Electrolytic Copper Foil Produced Therewith
Ta Sputtering Target and Method for Preparation Thereof
Epitaxial Growth Method and Substrate for Epitaxial Growth
Sputtering Target, Thin Film for Optical Information Recording Medium and Process for Producing the Same
Hafnium Alloy Target and Process for Producing the Same
Copper Alloy Sputtering Target Process for Producing the Same and Semiconductor Element Wiring
Electroless Gold Plating Liquid
Tantalum Sputtering Target and Method of Manufacturing Same
Method for Electroless Plating and Metal-Plated Article
Electroless Gold Plating Liquid
Sputtering target and method for production thereof
Sputtering Target and Method for Finishing Surface of Such Target
High Purity Copper Sulfate and Method for Production Thereof
Ito Sputtering Target
Electroless Gold Plating Solution
High-purity ni-v alloy target therefrom high-purity ni-v alloy thin film and process for producing high-purity ni-v alloy
Tantalum Sputtering Target
Nickel Alloy Sputtering Target and Nickel Alloy Thin Film
Electroless Copper Plating Solution
Pretreating Agent for Electroless Plating, Method of Electroless Plating Using the Same and Product of Electroless Plating
Surface-Treating Agent for Metal
Copper Electrolytic Solution Containing as Additive Compound Having Specific Skeleton, and Electrolytic Copper Foil Manufactured Therewith
Copper Foil Having Blackened Surface or Layer
High- Purity Ru Powder, Sputtering Target Obtained by Sintering the Same, Thin Film Obtained by Sputtering the Target and Process for Producing High-Purity Ru Powder
Sputtering Target with Few Surface Defects, and Surface Processing Method Thereof
Co-Cr-Pt-B Alloy Sputtering Target
Metal Plating Method, Pretreatment Agent, and Semiconductor Wafer and Semiconductor Device Obtained Using These
Cdte-Base Compound Semiconductor Single Crystal for Electro-Optic Element
High Purity Electrolytic Copper and Its Production Method
Ii-Vi Compound Semiconductor Crystal and Photoelectric Conversion Device
Copper Electrolytic Solution Containing Amine Compound Having Specific Skeleton and Organosulfur Compound as Additives, and Electrolytic Copper Foil Produced Using the Same
Target of High-Purity Nickel or Nickel Alloy and Its Producing Method
Basic Silane Coupling Agent Organic Carboxylate Composition, Method for Producing the Same, and Epoxy Resin Composition Containing the Same
Tantalum Sputtering Target and Method for Preparation Thereof
Tantalum Sputtering Target and Method for Preparation Thereof
Sputtering Target for Phase-Change Memory, Film for Phase Change Memory Formed by Using the Target, and Method for Producing the Target
Metallic Powder for Powder Metallurgy Whose Main Component Is Iron and Iron-Based Sintered Body
Metallic Powder for Powder Metallurgy Whose Main Component Is Iron and Iron-Based Sintered Body
Determination Method and Processing Method of Machined Surface of Plate-Like Material, and Apparatus for Use in Said Methods
High Purity Zrb2 Powder and Manufacturing Method Thereof
Copper Electrolytic Solution Containing Quaternary Amine Compound with Specific Skeleton and Organo-Sulfur Compound as Additives, and Electrolytic Copper Foil Manufactured Using the Same
Wafer Storage Container
Electroless Gold Plating Solution
Method for Growing Epitaxial Crystal
Cdte System Compound Semiconductor Single Crystal
Manganese Alloy Sputtering Target and Method for Producing the Same
Sputtering Target for Producing Metallic Glass Membrane and Manufacturing Method Thereof
Sb-Te Alloy Sintered Compact Target and Manufacturing Method Thereof
Resin Substrate Material, Electronic Component Substrate Material Manufactured by Electroless Plating on the Same, and Method for Manufacturing Electronic Component Substrate Material
Sb-Te Alloy Powder for Sintering, Sintered Compact Sputtering Target Obtained by Sintering Said Powder, and Manufacturing Method of Sb-Te Alloy Powder for Sintering
Copper Alloy for Electronic Materials
Cu-Ni-Si-Co-Cr Copper Alloy for Electronic Materials and Method for Manufacturing Same
Method for Leaching Gold
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same
Pot-Shaped Copper Sputtering Target and Manufacturing Method Thereof
Sputtering Target
Chromic Oxide Powder for Sputtering Target, and Sputtering Target Manufactured from such Chromic Oxide Powder
Copper Electrolytic Solution Containing Quaternary Amine Compound Polymer with Specific Skeleton and Organo-Sulfur Compound as Additives, and Electrolytic Copper Foil Manufactured Using the Same
Sn-Plated Copper Alloy Strip Having Improved Fatigue Characteristics
Electroless Palladium Plating Liquid
Two-Layer Flexible Substrate
Gallium Oxide-Zinc Oxide Sputtering Target, Method for Forming Transparent Conductive Film, and Transparent Conductive Film
Gallium Oxide-Zinc Oxide Sputtering Target, Method of Forming Transparent Conductive Film, and Transparent Conductive Film
High-Purity Hafnium, Target and Thin Film Comprising High-Purity Hafnium, and Process for Producing High-Purity Hafnium
Iron-Based Sintered Compact and Method for Production Thereof
Electrolytic Copper Plating Method, Phosphorous Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer Having Low Particle Adhesion Plated with Said Method and Anode
Method for Analyzing Minute Amounts of Pd, Rh and Ru, and High-Frequency Plasma Mass Spectroscope Used for Same
Sputtering Target
High-Purity Ru Alloy Target, Process for Producing the Same, and Sputtered Film
Gallium Oxide/Zinc Oxide Sputtering Target, Method of Forming Transparent Conductive Film and Transparent Conductive Film
Process for Producing Scorodite and Recycling the Post-Scorodite-Synthesis Solution
Lithium Nickel Manganese Cobalt Composite Oxide and Lithium Rechargeable Battery
Nonmagnetic Material Particle Dispersed Ferromagnetic Material Sputtering Target
Sputtering Target, Thin Film for Optical Information Recording Medium and Process for Producing the Same
Zirconium Crucible
Hafnium Alloy Target and Process for Producing the Same
Method for Operating Non-Ferrous Smelting Plant
Process of Leaching Gold
Method of Obtaining Copper from Ore
Substrate for Growing Compound Semiconductor and Epitaxial Growth Method
Metal-Coated Lipid Bilayer Vesicles and Process for Producing Same
Hafnium Alloy Target
Hafnium Alloy Target
Nickel Crucible for Melting Analytical Sample, Method of Preparing Analytical Sample and Method of Analysis
Sintered Sputtering Target Made of Refractory Metals
Method for Determining Machining Plane of Planar Material, Machining Method and Device for Determining Machining Plane and Flat Surface Machining Device
Zinc Oxide-Based Transparent Conductor and Sputtering Target for Forming the Transparent Conductor
Method of Surface Treatment Using Imidazole Compound
Lithium-Containing Transition Metal Oxide Target, Process for Producing the Same and Lithium Ion Thin Film Secondary Battery
Zirconium Crucible for Melting Analytical Sample, Method of Preparing Analytical Sample and Method of Analysis
Rolled Copper or Copper Alloy Foil with Roughened Surface and Method of Roughening Rolled Copper or Copper Alloy Foil
Sputtering Target/Backing Plate Bonded Body
Zinc Oxide Based Transparent Electric Conductor, Sputtering Target for Forming of the Conductor and Process for Producing the Target
Lithium-Manganese Composite Oxides for Lithium Ion Battery and Process for Preparing Same
Plated Article Having Metal Thin Film Formed by Electroless Plating, and Manufacturing Method Thereof
Plated Article Having Metal Thin Film Formed by Electroless Plating
Cu-Ni-Si-Co Copper Alloy for Electronic Materials and Method for Manufacturing Same
Copper Alloy Sputtering Target and Semiconductor Element Wiring
Hafnium Silicide Target for Forming Gate Oxide Film, and Method for Preparation Thereof
Method of Recovering Silver Using Anion-Exchange Resin
Electrode Plate Transportation Apparatus
Method of Leaching Copper Sulfide Ore with the Use of Iodine
Sb-Te Base Alloy Sinter Sputtering Target
Method for Collection of Valuable Metal from Ito Scrap
Method for Collection of Valuable Metal from Ito Scrap
Method for Collection of Valuable Metal from Ito Scrap
Method for Collection of Valuable Metal from Ito Scrap
Method for Collection of Valuable Metal from Ito Scrap
Electronic Component Formed with Barrier-Seed Layer on Base Material
Electronic Component Formed with Barrier-Seed Layer on Base Material
Roll Unit Dipped in Surface Treatment Liquid
Copper Anode or Phosphorous-Containing Copper Anode, Method of Electroplating Copper on Semiconductor Wafer, and Semiconductor Wafer with Low Particle Adhesion
Method of Recovering Valuable Metal from Scrap Conductive Oxide
Method of Recovering Valuable Metal from Scrap Containing Conductive Oxide
Method of Recovering Valuable Metal from Scrap Containing Conductive Oxide
Ytterbium Sputtering Target and Method of Producing said Target
Method of Heap or Dump Leaching of Copper from Copper Sulfide Ore
Sputtering Target and Manufacturing Method Thereof
Barrier Film for Flexible Copper Substrate and Sputtering Target for Forming Barrier Film
Amorphous Film of Composite Oxide, Crystalline Film of Composite Oxide, Method of Producing Said Films and Sintered Compact of Composite Oxide
Sintered Compact of Composite Oxide, Amorphous Film of Composite Oxide, Process for Producing Said Film, Crystalline Film of Composite Oxide and Process for Producing Said Film
Method for Supporting Metal Nanoparticles and Metal Nanoparticles-Carrying Substrate
Copper Foil for Printed Circuit and Copper-Clad Laminate
Sputtering Target, Thin Film for Optical Information Recording Medium and Process for Producing the Same
Substrate and Manufacturing Method Therefor
Substrate and Manufacturing Method Therefor
Ulsi Micro-Interconnect Member Having Ruthenium Electroplating Layer on Barrier Layer
Plated Product Having Copper Thin Film Formed Thereon by Electroless Plating
Metal Covered Polyimide Composite, Process for Producing the Composite, and Process for Producing Electronic Circuit Board
High Purity Ytterbium, Sputtering Target Made Thereof, Thin Film Containing the Same, and Method of Producing the Same
Method for Producing a-Igzo Oxide Thin Film
Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic Material
Iron Silicide Powder and Method for Production Thereof
Sputtering Target, Thin Film for Optical Information Recording Medium and Process for Producing the Same
High-Purity Ni-V Alloy, Target Therefrom, High-Purity Ni-V Alloy Thin Film and Process for Producing High-Purity Ni-V Alloy
High-Purity Lanthanum, Sputtering Target Comprising High-Purity Lanthanum, and Metal Gate Film Mainly Comprising High-Purity Lanthanum
Hybrid Silicon Wafer and Method of Producing the Same
Hybrid Silicon Wafer and Method of Producing the Same
Sputtering Target for Producing Metallic Glass Membrane and Manufacturing Method Thereof
Electrolytic Copper Plating Method, Pure Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer Having Low Particle Adhesion Plated with Said Method and Anode
Method of Recovering Valuable Metals from Izo Scrap
Method of Recovering Valuable Metals from Izo Scrap
Method of Recovering Valuable Metals from Izo Scrap
Sintered Oxide Compact Target for Sputtering and Process for Producing the same
Method for Separating and Recovering Nickel and Lithium
Titanium Target for Sputtering
Method for Production of High Purity Copper Sulfate
Iron Silicide Sputtering Target and Method for Production Thereof
Sputtering Target with Low Generation of Particles
Positive Electrode Active Material for Lithium Ion Battery, Positive Electrode for Secondary Battery, and Lithium Ion Battery
Method of Manufacturing a Ni-Pt Alloy
Method of Producing Mixed Powder Comprising Noble Metal Powder and Oxide Powder, and Mixed Powder Comprising Noble Metal Powder and Oxide Powder
Substrate Comprising Alloy Film of Metal Element Having Barrier Function and Metal Element Having Catalytic Power
Hybrid Silicon Wafer and Method for Manufacturing Same
Nickel Alloy Sputtering Target and Nickel Silicide Film
Sputtering Target with Few Surface Defects, and Surface Processing Method Thereof
Method of Leaching Copper Sulfide Ore
Barrier Film for Semiconductor Wiring, Sintered Compact Sputtering Target and Method of Producing the Sputtering Target
Oxide Sintered Compact for Producing Transparent Conductive Film
Sputtering Target and Process for Producing Same
Metal Foil with Electric Resistance Film and Method of Producing the Same
Copper Foil for Printed Circuit
Nonmagnetic Material Particle-Dispersed Ferromagnetic Material Sputtering Target
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same
Thin Film Comprising Titanium Oxide as Main Component and Sintered Compact Sputternig Target Comprising Titanium Oxide as Main Component
Inorganic-Particle-Dispersed Sputtering Target
Lanthanum Target for Sputtering
Lanthanum Target for Sputtering
Method of Roughening Rolled Copper or Copper Alloy Foil
Positive Electrode Active Material For Lithium Ion Battery
Sputtering Target of Sintered Ti-Nb Based Oxide, Thin Film of Ti-Nb Based Oxide, and Method of Producing the Thin Film
Indium Oxide Sintered Compact, Indium Oxide Transparent Conductive Film, and Manufacturing Method of Indium Oxide Transparent Conductive Film
Method of Storing Lanthanum Oxide Target, and Vacuum-Sealed Lanthanum Oxide Target
Sputtering Target of Ferromagnetic Material with Low Generation of Particles
Target of Sintered Compact, and Method of Producing the Sintered Compact
Process and Apparatus for Producing a Metal Covered Polyimide Composite
Aqueous Solution Containing Divalent Iron Ions
Nickel-Iron Alloy Plating Solution
Ferromagnetic Material Sputtering Target
High-Purity Aqueous Copper Sulfonate Solution and Method of Producing Same
Method for Producing High-Purity Tungsten Powder
Hybrid Silicon Wafer
Hybrid Silicon Wafer
Sintered Compact of Indium Oxide System, and Transparent Conductive Film of Indium Oxide System
Electroless Plating Pretreatment Agent, Electroless Plating Method Using Same, and Electroless Plated Object
Indium Target and Manufacturing Method Thereof
Sputtering Target-Backing Plate Assembly, and Its Production Method
Sputtering Target of Magnetic Material
Positive Electrode For Lithium Ion Battery, Method For Producing Said Positive Electrode, And Lithium Ion Battery
Positive Electrode Active Material For Lithium Ion Battery, Positive Electrode For Lithium Ion Battery, And Lithium Ion Battery
Positive Electrode Active Material For Lithium Ion Battery, Positive Electrode For Lithium Ion Battery, And Lithium Ion Battery
Method For Producing Positive Electrode Active Material For Lithium Ion Battery And Positive Electrode Active Material For Lithium Ion Battery
Tantalum Coil for Sputtering and Method for Processing the Coil
Positive Electrode Active Material for Lithium-Ion Battery, Positive Electrode for Lithium-Ion Battery, and Lithium-Ion Battery
Positive-Electrode Active Material For Lithium Ion Battery, Positive Electrode For Lithium Ion Battery, And Lithium Ion Battery
Positive Electrode Active Substance For Lithium Ion Batteries, Positive Electrode For Lithium Ion Batteries, And Lithium Ion Battery
Positive Electrode Active Substance for Lithium Ion Batteries, Positive Electrode for Lithium Ion Batteries, and Lithium Ion Battery
Positive Electrode Active Substance For Lithium Ion Batteries, Positive Electrode For Lithium Ion Batteries, And Lithium Ion Battery
Sintered Compact, Amorphous Film and Crystalline Film of Composite Oxide, and Process for Producing the Films
Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic Material
Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic Material
Ni ALLOY SPUTTERING TARGET, Ni ALLOY THIN FILM AND Ni SILICIDE FILM
Method for Producing Positive Electrode Active Material for Lithium Ion Batteries and Positive Electrode Active Material for Lithium Ion Batteries
Tantalum Sputtering Target
Laminated Structure And Method For Producing The Same
Sputtering Target of Ferromagnetic Material with Low Generation of Particles
Fe-Pt-Based Ferromagnetic Material Sputtering Target
Cu-In-Ga-Se QUATERNARY ALLOY SPUTTERING TARGET
Carrier-Attached Copper Foil
Titanium Target for Sputtering
Liquid Crystal Polymer Copper-Clad Laminate and Copper Foil Used For Said Laminate
Copper Foil for Printed Wiring Board, Method for Producing Said Copper Foil, Resin Substrate for Printed Wiring Board and Printed Wiring Board
Production Method for High-Purity Lanthanum, High-Purity Lanthanum, Sputtering Target Composed of High-Purity Lanthanum, and Metal Gate Film Containing High-Purity Lanthanum as Main Component
Method for Producing High-Purity Lanthanum, High-Purity Lanthanum, Sputtering Target Formed from High-Purity Lanthanum, and Metal Gate Film Having Highy-Purity Lanthanum as Main Component
Positive Electrode Active Material for Lithium Ion Batteries, Positive Electrode for Lithium Ion Batteries, and Lithium Ion Battery
Polycrystalline Silicon Wafer
Rolled Copper or Copper-Alloy Foil Provided with Roughened Surface
Metal Foil Having Electrical Resistance Layer, and Manufacturing Method for Same
High-Purity Copper-Manganese-Alloy Sputtering Target
Process for Producing High-Purity Tin
Surface Treated Copper Foil and Laminate Using the Same
High Purity Copper-Manganese Alloy Sputtering Target
Cathode Active Material For Lithium Ion Battery, Cathode For Lithium Ion Battery, And Lithium Ion Battery
Cathode Active Material For Lithium Ion Battery, Cathode For Lithium Ion Battery, And Lithium Ion Battery
Sputtering Target Assembly
Polycrystalline Silicon Wafer
Positive Electrode Active Material For Lithium-Ion Battery, Positive Electrode For A Lithium-Ion Battery, Lithium-Ion Battery Using Same, And Precursor To A Positive Electrode Active Material For A Lithium-Ion Battery
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.