Titanium target for sputtering
View Patent ↗Provided is a titanium target for sputtering having a Shore hardness Hs of 20 or more and a basal plane orientation ratio of 70% or less. In the titanium target for sputtering, the purity of titanium is 99.995 mass % or more, excluding gas components. It is an object of the present invention to provide a high-quality titanium target for sputtering, in which impurities are reduced, and which can prevent occurrence of cracking or breaking in high-power sputtering (high-rate sputtering), stabilize sputtering characteristics, and effectively suppress occurrence of particles during formation of a film.
1. A titanium target for sputtering having a Shore hardness Hs of 20 or more, a basal plane orientation ratio of 70% or less, and a 0.2% proof stress in a tensile test at room temperature (23° C.) of 330 N/mm 2 or more.
2. The titanium target for sputtering according to claim 1 , having a purity of 99.995 mass % or more, excluding gas components.
3. The titanium target for sputtering according to claim 1 , wherein the Shore hardness Hs is 25 or more.
4. The titanium target for sputtering according to claim 1 , wherein the basal plane orientation ratio is 55% or less.
5. A titanium target for sputtering having a Shore hardness Hs of 25 or more and a basal plane orientation ratio of 70% or less.
6. The titanium target for sputtering according to claim 5 , wherein the basal plane orientation ratio is 55% or less.
7. The titanium target for sputtering according to claim 5 , wherein the titanium target has a 0.2% proof stress in a tensile test at room temperature (23° C.) of 330 N/mm 2 or more.
8. The titanium target for sputtering according to claim 5 having a purity of 99.995 mass % or more, excluding gas components.
9. A titanium target for sputtering, having a Shore hardness Hs of 20 or more, a basal plane orientation ratio of 70% or less, and a 0.2% proof stress in a tensile test at 500° C. of 36 N/mm 2 or more.
10. The titanium target for sputtering according to claim 9 , wherein the Shore hardness Hs is 25 or more.
11. The titanium target for sputtering according to claim 9 having a purity of 99.995 mass % or more, excluding gas components.
12. The titanium target for sputtering according to claim 9 , wherein the basal plane orientation ratio is 55% or less.
13. The titanium target for sputtering according to claim 9 , wherein the 0.2% proof stress in a tensile test at room temperature (23° C.) is 330 N/mm 2 or more.