Patent Assignment
Reel/Frame 057160/0114
Change of Address
Recorded: 2021-08-11
Pages: 20
Assignor
JX NIPPON MINING & METALS CORPORATION
Executed: 2020-06-29
Assignee
JX NIPPON MINING & METALS CORPORATION
10-4, TORANOMON 2-CHOME, MINATO-KU, TOKYO, 100-8164, JAPAN
Covered Properties
(464)
Process of Treatment for Oxidizing an Acidic Solution Containing an Iodide Ion and an Iron (Ii) Ion
Method for Processing Acidic Solution That Contains Iodide Ions and Iron Ions
Reflow Sn Plated Material
Method for Leaching Copper from Copper Sulfide Ore
Method of Recovering Gold from Dilute Gold Solution
Method of Leaching Copper Ore
Cu-Ni-Si Alloy for Electronic Material
Process of Leaching Gold
Copper Foil for Printed Wiring Board
Cu-Co-Si Alloy Material
Electromagnetic Shielding Material and Method of Producing Electromagnetic Shielding Material
Fuel Cell Separator Material, Fuel Cell Separator Using Same, and Fuel Cell Stack
Process for Recovery of Copper from Copper-Containing Chloride Media
Copper Foil for Producing Graphene and Method of Producing Graphene Using the Same
Method of Leaching Copper and Gold from Sulfide Ores
Metallic Material for Electronic Components, and Connector Terminals, Connectors and Electronic Components Using Same
Copper Foil for Producing Graphene and Method of Producing Graphene Using the Same
Copper Alloy Sheet with Excellent Heat Dissipation and Workability in Repetitive Bending
Ni-Si-Co COPPER ALLOY AND MANUFACTURING METHOD THEREFOR
Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIALS AND MANUFACTURING METHOD THEREOF
High-Strength Titanium Copper Foil and Method for Producing Same
Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIALS, AND METHOD OF MANUFACTURING SAME
Cu-Ni-Si-Co Copper Alloy for Electronic Material and Process for Producing Same
Cu-Si-Co-BASED COPPER ALLOY FOR ELECTRONIC MATERIALS AND METHOD FOR PRODUCING THE SAME
Metal Foil for Electromagnetic Shielding, Electromagnetic Shielding Material, and Shielding Cable
Copper Foil for Producing Graphene and Method of Producing Graphene Using the Same
STRIP OF Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIALS AND THE METHOD FOR PRODUCING THE SAME
Cu-Si-Co Alloy for Electronic Materials, and Method for Producing Same
Copper Foil Composite
Camera Module and Titanium-Copper Foil
Metal Material for Electronic Component and Method for Manufacturing the Same
Metal Foil Provided with Electrically Resistive Layer, and Board for Printed Circuit Using Said Metal Foil
Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board
Electronic Component Metal Material and Method for Manufacturing the Same
Copper Foil for Printed Circuit
Indium Oxide Transparent Conductive Film
Copper or Copper Alloy, Bonding Wire, Method of Producing the Copper, Method of Producing the Copper Alloy, and Method of Producing the Bonding Wire
Sputtering Target for Magnetic Recording Film and Process for Production Thereof
Method for Connecting Magnetic Substance Target to Backing Plate, and Magnetic Substance Target
Oxide Sintered Compact, Its Production Method, and Raw Material Powder for Producing Oxide Sintered Compact
Titanium Target for Sputtering
Target formed of Sintering-Resistant Material of High-Melting Point Metal Alloy, High-Melting Point Metal Silicide, High-Melting Point Metal Carbide, High-Melting Point Metal Nitride, or High-Melting Point Metal Boride, Process for Producing the Target, Assembly of the Sputtering Target-Backing Plate, and Process for Producing the Same
Sputtering Target for Magnetic Recording Film
Sputtering Target, Sputtering Target-Backing Plate Assembly and Deposition System
Sputtering Target and Manufacturing Method Therefor
Backing Plate-Integrated Metal Sputtering Target and Method of Producing Same
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board
High Purity Manganese and Method for Producing Same
Press-Fit Terminal and Electronic Component Using the Same
Surface Treated Copper Foil and Laminate Using the Same, Printed Wiring Board, and Copper Clad Laminate
Ruthenium-Alloy Sputtering Target
Co-Cr-Pt-Based Sputtering Target and Method for Producing Same
Indium Sputtering Target And Method For Manufacturing Same
Indium Cylindrical Sputtering Target And Manufacturing Method Thereof
Magnetic Material Sputtering Target and Manufacturing Method for Same
Copper Alloy Sputtering Target, Process for Producing the Same and Semiconductor Element Wiring
High-Purity Copper Sputtering Target
Ferromagnetic Material Sputtering Target Containing Chromium Oxide
Copper Foil with Carrier
Magnetic Material Sputtering Target and Manufacturing Method Thereof
Material Fuel Cell Separator, Fuel Cell Separator Using Same, Fuel Cell Stack, and Method of Producing Fuel Cell Separator Material
Tungsten Sintered Compact Sputtering Target and Method for Producing Same
Carrier-Attached Copper Foil
Rolled Copper Foil for Producing Two-Dimensional Hexagonal Lattice Compound and Method of Producing Two-Dimensional Hexagonal Lattice Compound
Tantalum Sputtering Target
Cu-Ni-Si BASED COPPER ALLOY
Tantalum Sputtering Target and Production Method Therefor
Tantalum Sputtering Target, Method for Manufacturing Same, and Barrier Film for Semiconductor Wiring Formed by Using Target
Copper alloy sputtering target and method for manufacturing the target
High-Purity Copper-Cobalt Alloy Sputtering Target
Cathode Active Material For Lithium-Ion Battery, Cathode For Lithium-Ion Battery and Lithium-Ion Battery
Sputtering Target And Method For Production Thereof
Ultrathin Copper Foil And Method Of Manufacturing The Same, And Ultrathin Copper Layer
Fe-Pt-Based Sputtering Target with Dispersed C Grains
Sputtering Target and/or Coil, and Process for Producing Same
Copper Foil Composite, Formed Product and Method of Producing the Same
Surface-Treated Copper Foil, Copper Foil with Carrier, Substrate, Resin Substrate, Printed Wiring Board, Copper Clad Laminate and Method for Producing Printed Wiring Board
Sputtering Target for Magnetic Recording Medium, and Process for Producing Same
Neodymium-Based Rare Earth Permanent Magnet and Process for Producing Same
Electronic Component Metal Material and Method for Manufacturing the Same
Copper Foil Composite, Formed Product and Method of Producing the Same
Polycrystalline Silicon Sputtering Target
Sintered Compact Magnesium Oxide Target for Sputtering, and Method for Producing Same
Metal Foil with Carrier
Sputtering Target-Backing Plate Assembly and Method for Producing Same
Indium Oxide Transparent Conductive Film
High-Purity Yttrium, Process of Producing High-Purity Yttrium, High-Purity Yttrium Sputtering Target, Metal Gate Film Deposited with High-Purity Yttrium Sputtering Target, and Semiconductor Element and Device Equipped with the Metal Gate Film
Tungsten Sintered Compact Sputtering Target and Tungsten Film Formed Using Same Target
Cu-Ga Target, Method of Producing Same, Light-absorbing Layer Formed from Cu-Ga Based Alloy Film, and CIGS System Solar Cell Having the Light-absorbing Layer
Copper-Cobalt-Silicon Alloy for Electrode Material
Surface-Treated Copper Foil
Fe-Based Magnetic Material Sintered Compact
Titanium-Copper Alloy Having Plating Layer
Method for Electrolytically Refining Lead in Sulfamate Bath
Method for Producing High-Purity Calcium
High-Purity Titanium Ingots, Manufacturing Method Therefor, and Titanium Sputtering Target
Gadolinium Sputtering Target and Production Method of Said Target
Copper Foil Provided with Carrier, Laminate, Printed Wiring Board, and Method for Fabricating Printed Wiring Board
Copper Foil Composite, Copper Foil Used for the Same, Formed Product and Method of Producing the Same
High-Strength Titanium Copper Foil and Method for Producing Same
Surface-Treated Copper Foil, Copper Foil with Carrier, Substrate, Resin Substrate, Printed Wiring Board, Copper Clad Laminate and Method for Producing Printed Wiring Board
Tantalum Sputtering Target
Copper Alloy Sputtering Target
High-Purity Copper-Chromium Alloy Sputtering Target
Ruthenium Sputtering Target and Ruthenium Alloy Sputtering Target
Magnetic Material Sputtering Target and Manufacturing Method Thereof
Sputtering Target for forming Magnetic Recording Film and Process for Producing Same
High Purity Cobalt Chloride and Manufacturing Method Therefor
NbO2 Sintered Compact, Sputtering Target Comprising the Sintered Compact, and Method of Producing NbO2 Sintered Compact
Sputtering Target-Backing Plate Assembly
Metallic Material for Electronic Components and Method for Producing Same, and Connector Terminals, Connectors and Electronic Components Using Same
Laminate Structure and Manufacturing Method Thereof
Tantalum Sputtering Target and Method for Producing Same
Titanium Target for Sputtering and Manufacturing Method Thereof
Tantalum Sputtering Target
Copper Foil for Printed Circuit
Tantalum Sputtering Target and Method for Producing Same
Metallic Material For Electronic Components And Method For Producing Same, And Connector Terminals, Connectors And Electronic Components Using Same
Metallic Material For Electronic Components And Method For Producing Same, And Connector Terminals, Connectors And Electronic Components Using Same
Copper Alloy Sputtering Target and Semiconductor Element Wiring
Method of Producing Low Alpha-Ray Emitting Bismuth, and Low Alpha-Ray Emitting Bismuth
Magnetic Material Sputtering Target and Method for Producing Same
Fe-Pt Based Magnetic Material Sintered Compact
Metallic Material For Electronic Components And Method For Producing Same, And Connector Terminals, Connectors And Electronic Components Using Same
Metal Foil for Electromagnetic Shielding, Electromagnetic Shielding Material, and Shielding Cable
Product Management System, and Host Computer and Recorded Medium Used in the System
Tantalum or Tungsten Target-Copper Alloy Backing Plate Assembly and Production Method Therefor
Diffusion-Joined Target Assemly of High-Purity Cobalt Target and Copper Alloy Backing Plate and Production Method Therefor
Patent:
6,793,124 →
Application:
10/239,556 →
Surface Treatment for Copper Foil
Oxide Sintered Body and Manufacturing Method Thereof
Patent:
6,843,975 →
Application:
10/130,238 →
MOSI2 Arc-Shaped Heater, and Method and Device for Manufacturing the Heater
Sputtering Target Producing Few Particles, Backing Plate or Sputtering Apparatus and Sputtering Method Producing Few Particles
Method of Producing a Higher-Purity Metal
Chamfered Semiconductor Wafer and Method of Manufacturing the Same
Water-Based Metal Surface Treatment Agent
Manufacturing Method of Ito Powder with Tin Dissolved in Indium Oxide, and Manufacturing Method of Ito Target
Process for Producing Single Crystal of Compound Semiconductor and Crystal Growing Apparatus
Sputtering Target and Transparent Conductive Film
Cdte-Base Compound Semiconductor Single Crystal for Electro-Optic Element
Copper Electrolytic Solution Containing Amine Compound Having Specific Skeleton and Organosulfur Compound as Additives, and Electrolytic Copper Foil Produced Using the Same
Basic Silane Coupling Agent Organic Carboxylate Composition, Method for Producing the Same, and Epoxy Resin Composition Containing the Same
Electrolytic Copper Plating Method, Phosphorous Copper Anode for Electrolytic Plating Method, and Semiconductor Wafer Having Low Particle Adhesion Plated with Said Method and Anode
Copper Electrolytic Solution Containing Organic Sulfur Compound and Quaternary Amine Compound of Specified Skeleton as Additives and Electrolytic Copper Foil Produced Therewith
Tantalum Sputtering Target and Method for Preparation Thereof
Sputtering Target for Phase-Change Memory, Film for Phase Change Memory Formed by Using the Target, and Method for Producing the Target
Process for Producing Compound Semiconductor Single Crystal
Electroless Plating Method and Semiconductor Wafer on Which Metal Plating Layer Is Formed
Cdte Single Crystal and Cdte Polycrystal, and Method for Preparation Thereof
Metal Powder for Powder Metallurgy and Iron-Based Sintered Compact
Production Method for Compound Semiconductor Single Crystal
Manganese Alloy Sputtering Target and Method for Producing the Same
Electroconductive Oxide Sintered Compact, Sputtering Target Comprising the Sintered Compact and Methods for Producing Them
Sputtering Target Containing Zinc Sulfide as Major Component, Optical Recording Medium on Which Phase Change Optical Disk Protective Film Containing Zinc Sulfide as Major Component Is Formed by Using the Target, and Method for Manufacturing the Sputtering Target
Lithium-Containing Complex Oxide and Method of Producing Same
Electroless Gold Plating Liquid
Vapor-Phase Epitaxial Apparatus and Vapor Phase Epitaxial Method
High Purity Electrolytic Copper and Its Production Method
Epitaxial Growth Method and Substrate for Epitaxial Growth
Copper Foil Having Blackened Surface or Layer
Vapor-Phase Growth Apparatus
Method for Connecting Magnetic Substance Target to Backing Plate, and Magnetic Substance Target
Electrolytic Copper Plating Method, Phosphorus-Containing Anode for Electrolytic Copper Plating, and Semiconductor Wafer Plated Using Them and Having Few Particles Adhering to It
Copper Electrolytic Solution Containing Amine Compound Having Specific Skeleton and Organosulfur Compound as Additives, and Electrolytic Copper Foil Produced Using the Same
Electroless Gold Plating Solution
Surface-Treating Agent for Metal
Electroless Gold Plating Solution
Electroless Gold Plating Liquid
Basic Silane Coupling Agent Organic Carboxylate Composition, Method for Producing the Same, and Epoxy Resin Composition Containing the Same
Hafnium Alloy Target and Process for Producing the Same
Method for Growing Epitaxial Crystal
Sputtering Target for Phase-Change Memory, Film for Phase Change Memory Formed by Using the Target, and Method for Producing the Target
Ito Sputtering Target
Copper Alloy Sputtering Target and Semiconductor Element Wiring
Wafer Storage Container
Cdte System Compound Semiconductor Single Crystal
High- Purity Ru Powder, Sputtering Target Obtained by Sintering the Same, Thin Film Obtained by Sputtering the Target and Process for Producing High-Purity Ru Powder
Nickel Alloy Sputtering Target and Nickel Alloy Thin Film
Target of High-Purity Nickel or Nickel Alloy and Its Producing Method
Copper Electroplating Method, Pure Copper Anode for Copper Electroplating, and Semiconductor Wafer Plated Thereby with Little Particle Adhesion
Determination Method and Processing Method of Machined Surface of Plate-Like Material, and Apparatus for Use in Said Methods
Surface Treated Copper Film
Gallium Oxide/Zinc Oxide Sputtering Target, Method of Forming Transparent Conductive Film and Transparent Conductive Film
Copper Electrolytic Solution Containing Quaternary Amine Compound Polymer with Specific Skeleton and Organo-Sulfur Compound as Additives, and Electrolytic Copper Foil Manufactured Using the Same
Method for Leaching Gold
Gallium Oxide-Zinc Oxide Sputtering Target, Method for Forming Transparent Conductive Film, and Transparent Conductive Film
Gallium Oxide-Zinc Oxide Sputtering Target, Method of Forming Transparent Conductive Film, and Transparent Conductive Film
High Purity Copper Sulfate and Method for Production Thereof
Ta Sputtering Target and Method for Preparation Thereof
Zinc Oxide-Based Transparent Conductor and Sputtering Target for Forming the Transparent Conductor
Electroless Palladium Plating Liquid
Pretreating Agent for Electroless Plating, Method of Electroless Plating Using the Same and Product of Electroless Plating
Manganese Alloy Sputtering Target and Method for Producing the Same
Tantalum Sputtering Target and Method for Preparation Thereof
Tantalum Sputtering Target and Method for Preparation Thereof
Target of High-Purity Nickel or Nickel Alloy and Its Producing Method
Copper Alloy Sputtering Target Process for Producing the Same and Semiconductor Element Wiring
Substrate for Growing Compound Semiconductor and Epitaxial Growth Method
Copper Electrolytic Solution Containing Quaternary Amine Compound with Specific Skeleton and Organo-Sulfur Compound as Additives, and Electrolytic Copper Foil Manufactured Using the Same
Method for Operating Non-Ferrous Smelting Plant
Copper Electrolytic Solution and Electrolytic Copper Foil Produced Therewith
Packaging Device and Packaging Method for Hollow Cathode Type Sputtering Target
Hydrogen Separation Membrane, Sputtering Target for Forming Said Hydrogen Separation Membrane, and Manufacturing Method Thereof
Rolled Copper Foil and Manufacturing Method Thereof
Electrolytic Copper Plating Method, Pure Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer Having Low Particle Adhesion Plated with Said Method and Anode
Cathode Material for Lithium Secondary Battery and Manufacturing Method Thereof
Sb-Te Alloy Sintered Compact Sputtering Target
Copper Electrolytic Solution Containing as Additive Compound Having Specific Skeleton, and Electrolytic Copper Foil Manufactured Therewith
Method of Obtaining Copper from Ore
Metal Plating Method and Pretreatment Agent
Sputtering Target Transport Box
High-Purity Ru Alloy Target, Process for Producing the Same, and Sputtered Film
High Purity Copper Sulfate and Method for Production Thereof
Tantalum Sputtering Target
Nickel Crucible for Melting Analytical Sample, Method of Preparing Analytical Sample and Method of Analysis
Sputtering Target with Few Surface Defects, and Surface Processing Method Thereof
Co-Cr-Pt-B Alloy Sputtering Target
Zirconium Crucible for Melting Analytical Sample, Method of Preparing Analytical Sample and Method of Analysis
High-Purity Ni-V Alloy, Target Therefrom, High-Purity Ni-V Alloy Thin Film and Process for Producing High-Purity Ni-V Alloy
Sb-Te Alloy Sintered Compact Target and Manufacturing Method Thereof
Electrolytic Copper Plating Method, Pure Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer Having Low Particle Adhesion Plated with Said Method and Anode
Sb-Te Alloy Powder for Sintering, Sintered Compact Sputtering Target Obtained by Sintering Said Powder, and Manufacturing Method of Sb-Te Alloy Powder for Sintering
Sputtering Target and Method for Finishing Surface of Such Target
Method of Manufacturing a Ni-Pt Alloy
Method of Surface Treatment Using Imidazole Compound
Iron Silicide Sputtering Target and Method for Production Thereof
Method for Determining Machining Plane of Planar Material, Machining Method and Device for Determining Machining Plane and Flat Surface Machining Device
Electronic Component Formed with Barrier-Seed Layer on Base Material
Zinc Oxide Based Transparent Electric Conductor, Sputtering Target for Forming of the Conductor and Process for Producing the Target
Method for Collection of Valuable Metal from Ito Scrap
Sputtering Target and Manufacturing Method Thereof
Resin Substrate Material, Electronic Component Substrate Material Manufactured by Electroless Plating on the Same, and Method for Manufacturing Electronic Component Substrate Material
Hafnium Alloy Target and Process for Producing the Same
Lithium-Containing Transition Metal Oxide Target, Process for Producing the Same and Lithium Ion Thin Film Secondary Battery
Cu-Ni-Si-Co-Cr Copper Alloy for Electronic Materials and Method for Manufacturing Same
Electronic Component Formed with Barrier-Seed Layer on Base Material
Lithium-Manganese Composite Oxides for Lithium Ion Battery and Process for Preparing Same
Nickel Alloy Sputtering Target and Nickel Silicide Film
Sintered Sputtering Target Made of Refractory Metals
Electrode Plate Transportation Apparatus
Method for Producing a-Igzo Oxide Thin Film
Method for Production of High Purity Copper Sulfate
Sputtering Target/Backing Plate Bonded Body
Method of Leaching Copper Sulfide Ore with the Use of Iodine
Plated Article Having Metal Thin Film Formed by Electroless Plating, and Manufacturing Method Thereof
Tantalum Sputtering Target and Method of Manufacturing Same
Iron Silicide Sputtering Target and Method for Production Thereof
Sputtering Target
Method for Electroless Plating and Metal-Plated Article
Sn-Plated Copper Alloy Strip Having Improved Fatigue Characteristics
Method of Recovering Silver Using Anion-Exchange Resin
Copper Anode or Phosphorous-Containing Copper Anode, Method of Electroplating Copper on Semiconductor Wafer, and Semiconductor Wafer with Low Particle Adhesion
Hafnium Alloy Target
Copper Alloy Sputtering Target and Semiconductor Element Wiring
Substrate and Manufacturing Method Therefor
Electrolytic Copper Plating Method, Phosphorous Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer Having Low Particle Adhesion Plated with Said Method and Anode
Method of Roughening Rolled Copper or Copper Alloy Foil
Amorphous Film of Composite Oxide, Crystalline Film of Composite Oxide, Method of Producing Said Films and Sintered Compact of Composite Oxide
Hybrid Silicon Wafer and Method of Producing the Same
Method of Leaching Copper Sulfide Ore
Hafnium Alloy Target
Sintered Compact of Composite Oxide, Amorphous Film of Composite Oxide, Process for Producing Said Film, Crystalline Film of Composite Oxide and Process for Producing Said Film
High-Purity Hafnium, Target and Thin Film Comprising High-Purity Hafnium, and Process for Producing High-Purity Hafnium
Plated Product Having Copper Thin Film Formed Thereon by Electroless Plating
Method of Heap or Dump Leaching of Copper from Copper Sulfide Ore
Method of Recovering Valuable Metals from Izo Scrap
Copper Alloy for Electronic Materials
Method for Supporting Metal Nanoparticles and Metal Nanoparticles-Carrying Substrate
Barrier Film for Flexible Copper Substrate and Sputtering Target for Forming Barrier Film
High-Purity Aqueous Copper Sulfonate Solution and Method of Producing Same
Process of Leaching Gold
Ulsi Micro-Interconnect Member Having Ruthenium Electroplating Layer on Barrier Layer
Plated Article Having Metal Thin Film Formed by Electroless Plating
Substrate Comprising Alloy Film of Metal Element Having Barrier Function and Metal Element Having Catalytic Power
Electroless Copper Plating Solution
Sputtering Target
Sputtering target and method for production thereof
Cu-Ni-Si-Co Copper Alloy for Electronic Materials and Method for Manufacturing Same
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same
Zirconium Crucible
Rolled Copper or Copper Alloy Foil with Roughened Surface and Method of Roughening Rolled Copper or Copper Alloy Foil
Thin Film Comprising Titanium Oxide as Main Component and Sintered Compact Sputternig Target Comprising Titanium Oxide as Main Component
Copper Foil for Printed Circuit
Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic Material
Two-Layer Flexible Substrate
Metal Covered Polyimide Composite, Process for Producing the Composite, and Process for Producing Electronic Circuit Board
Method for Recovering Metal from Ore
High Purity Zrb2 Powder and Manufacturing Method Thereof
Positive-Electrode Active Material For Lithium Ion Battery, Positive Electrode For Lithium Ion Battery, And Lithium Ion Battery
Copper Foil for Printed Circuit and Copper-Clad Laminate
Hybrid Silicon Wafer and Method of Producing the Same
Sputtering Target for Producing Metallic Glass Membrane and Manufacturing Method Thereof
Sputtering Target with Few Surface Defects, and Surface Processing Method Thereof
Sputtering Target for Producing Metallic Glass Membrane and Manufacturing Method Thereof
Titanium Target for Sputtering
Sputtering Target of Ferromagnetic Material with Low Generation of Particles
Method of Recovering Valuable Metal from Scrap Conductive Oxide
Method of Recovering Valuable Metal from Scrap Containing Conductive Oxide
Metal-Coated Lipid Bilayer Vesicles and Process for Producing Same
Process and Apparatus for Producing a Metal Covered Polyimide Composite
Pot-Shaped Copper Sputtering Target and Manufacturing Method Thereof
Sintered Compact, Amorphous Film and Crystalline Film of Composite Oxide, and Process for Producing the Films
Aqueous Solution Containing Divalent Iron Ions
Method of Recovering Valuable Metal from Scrap Containing Conductive Oxide
Substrate and Manufacturing Method Therefor
Positive Electrode Active Material For Lithium Ion Battery
Metal Foil with Electric Resistance Film and Method of Producing the Same
Method of Producing Mixed Powder Comprising Noble Metal Powder and Oxide Powder, and Mixed Powder Comprising Noble Metal Powder and Oxide Powder
Sputtering Target of Sintered Ti-Nb Based Oxide, Thin Film of Ti-Nb Based Oxide, and Method of Producing the Thin Film
Method for Producing High-Purity Tungsten Powder
Indium Oxide Sintered Compact, Indium Oxide Transparent Conductive Film, and Manufacturing Method of Indium Oxide Transparent Conductive Film
Electroless Plating Pretreatment Agent, Electroless Plating Method Using Same, and Electroless Plated Object
High-purity ni-v alloy target therefrom high-purity ni-v alloy thin film and process for producing high-purity ni-v alloy
Chromic Oxide Powder for Sputtering Target, and Sputtering Target Manufactured from such Chromic Oxide Powder
Sb-Te Base Alloy Sinter Sputtering Target
Method of Storing Lanthanum Oxide Target, and Vacuum-Sealed Lanthanum Oxide Target
Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic Material
Sputtering Target with Low Generation of Particles
Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic Material
High-Purity Lanthanum, Sputtering Target Comprising High-Purity Lanthanum, and Metal Gate Film Mainly Comprising High-Purity Lanthanum
Carrier-Attached Copper Foil
Polycrystalline Silicon Wafer
Method for Producing High-Purity Lanthanum, High-Purity Lanthanum, Sputtering Target Formed from High-Purity Lanthanum, and Metal Gate Film Having Highy-Purity Lanthanum as Main Component
Laminated Structure And Method For Producing The Same
Oxide Sintered Compact for Producing Transparent Conductive Film
Copper Foil for Printed Wiring Board, Method for Producing Said Copper Foil, Resin Substrate for Printed Wiring Board and Printed Wiring Board
Nonmagnetic Material Particle Dispersed Ferromagnetic Material Sputtering Target
Sputtering Target and Process for Producing Same
Inorganic-Particle-Dispersed Sputtering Target
Sintered Oxide Compact Target for Sputtering and Process for Producing the same
Rolled Copper or Copper-Alloy Foil Provided with Roughened Surface
Barrier Film for Semiconductor Wiring, Sintered Compact Sputtering Target and Method of Producing the Sputtering Target
Polycrystalline Silicon Wafer
Positive Electrode Active Material for Lithium Ion Battery, Positive Electrode for Secondary Battery, and Lithium Ion Battery
Liquid Crystal Polymer Copper-Clad Laminate and Copper Foil Used For Said Laminate
Sputtering Target-Backing Plate Assembly, and Its Production Method
Titanium Target for Sputtering
Tantalum Sputtering Target
Positive Electrode Active Material for Lithium-Ion Battery, Positive Electrode for Lithium-Ion Battery, and Lithium-Ion Battery
High-Purity Copper-Manganese-Alloy Sputtering Target
Metal Foil Having Electrical Resistance Layer, and Manufacturing Method for Same
Nonmagnetic Material Particle-Dispersed Ferromagnetic Material Sputtering Target
Positive Electrode Active Material For Lithium Ion Battery, Positive Electrode For Lithium Ion Battery, And Lithium Ion Battery
Lithium Nickel Manganese Cobalt Composite Oxide and Lithium Rechargeable Battery
Indium Target and Manufacturing Method Thereof
High Purity Copper-Manganese Alloy Sputtering Target
Sputtering Target of Ferromagnetic Material with Low Generation of Particles
Sintered Compact of Indium Oxide System, and Transparent Conductive Film of Indium Oxide System
Positive Electrode Active Material for Lithium Ion Batteries, Positive Electrode for Lithium Ion Batteries, and Lithium Ion Battery
Positive Electrode Active Substance for Lithium Ion Batteries, Positive Electrode for Lithium Ion Batteries, and Lithium Ion Battery
Method for Producing Positive Electrode Active Material for Lithium Ion Batteries and Positive Electrode Active Material for Lithium Ion Batteries
Cathode Active Material For Lithium Ion Battery, Cathode For Lithium Ion Battery, And Lithium Ion Battery
Cathode Active Material For Lithium Ion Battery, Cathode For Lithium Ion Battery, And Lithium Ion Battery
Sputtering Target Assembly
Positive Electrode Active Substance For Lithium Ion Batteries, Positive Electrode For Lithium Ion Batteries, And Lithium Ion Battery
Ferromagnetic Material Sputtering Target
Positive Electrode Active Material For Lithium Ion Battery, Positive Electrode For Lithium Ion Battery, And Lithium Ion Battery
Surface Treated Copper Foil and Laminate Using the Same
Production Method for High-Purity Lanthanum, High-Purity Lanthanum, Sputtering Target Composed of High-Purity Lanthanum, and Metal Gate Film Containing High-Purity Lanthanum as Main Component
Nickel-Iron Alloy Plating Solution
Positive Electrode Active Substance For Lithium Ion Batteries, Positive Electrode For Lithium Ion Batteries, And Lithium Ion Battery
Ni ALLOY SPUTTERING TARGET, Ni ALLOY THIN FILM AND Ni SILICIDE FILM
Positive Electrode Active Material For Lithium-Ion Battery, Positive Electrode For A Lithium-Ion Battery, Lithium-Ion Battery Using Same, And Precursor To A Positive Electrode Active Material For A Lithium-Ion Battery
Sputtering Target of Magnetic Material
Cu-In-Ga-Se QUATERNARY ALLOY SPUTTERING TARGET
Target of Sintered Compact, and Method of Producing the Sintered Compact
Method For Producing Positive Electrode Active Material For Lithium Ion Battery And Positive Electrode Active Material For Lithium Ion Battery
Ytterbium Sputtering Target and Method of Producing said Target
Fe-Pt-Based Ferromagnetic Material Sputtering Target
Process for Producing High-Purity Tin
Lanthanum Target for Sputtering
Tantalum Coil for Sputtering and Method for Processing the Coil
Lanthanum Target for Sputtering
Low alpha-Dose Tin or Tin Alloy, and Method for Producing Same
High-Purity Copper or High-Purity Copper Alloy Sputtering Target, Process for Manufacturing the Sputtering Target, and High-Purity Copper or High-Purity Copper Alloy Sputtered Film
Copper or copper alloy target/copper alloy backing plate assembly
High Purity Copper and Method of Producing High Purity Copper Based on Electrolysis
Indium Target and Method for Manufacturing Same
Method for Producing High-Purity Calcium
Surface Treated Copper Foil and Laminate Using the Same
Titanium Target for Sputtering
Recycling Method for Tantalum Coil for Sputtering and Tantalum Coil Obtained by the Recycling Method
Sputtering Target for Magnetic Recording Film
Sputtering Target for Magnetic Recording Film, and Process for Producing Same
Process of Leaching Gold
Radiation Detector Ubm Electrode Structure Body, Radiation Detector, and Method of Manufacturing Same
Cylindrical Sputtering Target, Cylindrical Compact, Manufacturing Method of Cylindrical Sputtering Target, and Manufacturing Method of Cylindrical Sintered Compact
Copper Foil Provided with Carrier, Laminate, Printed Wiring Board, Electronic Device and Method for Fabricating Printed Wiring Board
Oxide Sintered Compact and Sputtering Target Formed from Said Oxide Sintered Compact
Sintered Compact Magnesium Oxide Target for Sputtering, and Method for Producing Same
Copper-Titanium Alloy for Electronic Component
Positive Electrode Active Material For Lithium-Ion Battery, A Positive Electrode For Lithium-Ion Battery, And Lithium-Ion Battery
Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device
LiCoO2 Sputtering Target, Production Method Therefor, And Positive Electrode Material Thin Film
Lithium Complex Oxide
Oxide Sintered Compact and Sputtering Target Formed from Said Oxide Sintered Compact
Tungsten Sputtering Target And Method For Producing Same
Copper Foil Provided with Carrier, Laminate, Printed Wiring Board, Electronic Device, and Method for Fabricating Printed Wiring Board
Printed Wiring Board, Electronic Device, Catheter, and Metallic Material
Ubm (Under Bump Metal) Electrode Structure for Radiation Detector, Radiation Detector and Production Method Thereof
Carrier-Attached Copper Foil, Laminate, Printed-Wiring Board and Method for Manufacturing the Printed Wiring Board
Metal Foil for Electromagnetic Shielding, Electromagnetic Shielding Material and Shielded Cable
Method for Producing Tungsten Carbide
Oxide Sintered Compact, Oxide Sputtering Target, and Oxide Thin Film
Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device
Sputtering Target for Magnetic Recording Medium, and Process for Producing Same
Copper Chloride, Cvd Raw Material, Copper Wiring Film, and Method for Producing Copper Chloride
Electromagnetic Shielding Material
Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device
Activated Carbon Regeneration Method and Gold Recovery Method
Punching Processing Method, Method of Manufacturing Press-formed Product, and Press-formed Product
Carrier-Attached Copper Foil, Laminate, Method for Manufacturing Printed-Wiring Board and Method for Manufacturing Electronic Device
Sputtering Target Comprising Ni-P Alloy or Ni-Pt-P Alloy and Production Method Therefor
Process for Producing a Target Formed of a Sintering-Resistant Material of a High-Melting Point Metal Alloy, Silicide, Carbide, Nitride or Boride
Carrier-Attached Copper Foil, Laminate, Laminate Producing Method, Printed Wiring Board Producing Method, And Electronic Device Producing Method
Copper-Titanium Alloy for Electronic Component
Carrier-Attached Copper Foil, Laminate, Method for Producing Printed Wiring Board, and Method for Producing Electronic Device
Cu-Co-Ni-Si Alloy for Electronic Components
Ni-Plated Copper Or Copper Alloy Material, Connector Terminal, Connector And Electronic Component Using The Same
Backing Plate Obtained by Diffusion-Bonding Anticorrosive Metal and Mo or Mo Alloy, and Sputtering Target-Backing Plate Assembly Provided with Said Backing Plate
Surface-Treated Copper Foil
Method for Recovering Gold from Activated Carbon
Method for Removing Copper from Lithium Ion Battery Scrap and Method for Recovering Metals
High Purity Tin and Method for Manufacturing Same
Method for Producing Tungsten
Electromagnetic Shielding Material
Method for Removing Iron from Iron-Containing Solution and Method for Recovering Valuable Metals
Copper Foil, Copper-Clad Laminate Board, Method for Producing Printed Wiring Board, Method for Producing Electronic Apparatus, Method for Producing Transmission Channel, and Method for Producing Antenna
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board
Copper Alloy Sputtering Target and Method for Manufacturing Same
Copper-titanium Alloy Foil Having Plated Layer
Sputtering Target Comprising Al-Te-Cu-Zr Alloy, and Method for Producing Same
Copper Sulfate, Copper Sulfate Solution, Plating Solution, Method for Producing Copper Sulfate, Method for Producing Semiconductor Circuit Board, and Method for Producing Electronic Apparatus
Surface-Treated Copper Foil, and Current Collector, Electrode, and Battery Cell Using the Surface-Treated Copper Foil
Method for Recovering at Least One Valuable Containing Tungsten
Method of Leaching Copper from Copper Sulfide Ore and Method of Evaluating Iodine Loss Content of Column Leaching Test of the Copper Sulfide Ore
Sputtering Target and/or Coil, and Process for Producing Same
CdTe-BASED COMPOUND SINGLE CRYSTAL AND METHOD FOR PRODUCING THE SAME
Tantalum Sputtering Target, and Production Method Therefor
Niobium Oxide Sintered Compact, Sputtering Target Formed from Said Sintered Compact, and Method of Producing Niobium Oxide Sintered Compact
Rare Earth Thin-Film Magnet and Method for Producing Same
Sputtering Target for Forming Magnetic Recording Film and Method for Producing Same
Laminate For Printed Wiring Board, Method Of Manufacturing Printed Wiring Board, And Method Of Manufacturing Electronic Device
Electromagnetic Shielding Material
Sputtering Target Comprising Al-Te-Cu-Zr-Based Alloy and Method of Manufacturing Same
Optical Modulator and Electric Field Sensor
Magnetic Material Sputtering Target and Method for Producing Same
Polyoxometalate and Method for Producing Polyoxometalate
Tantalum Sputtering Target, and Production Method Therefor
Copper Alloy Sheet Material and Method of Manufacturing the Same
Cylindrical Sputtering Target
Semiconductor Wafer, and Method for Polishing Semiconductor Wafer
Monocrystalline Silicon Sputtering Target
Cu-Ni-Si Based Rolled Copper Alloy and Production Method Thereof
Master Alloy For Sputtering Target and Method For Producing Sputtering Target
Method for Treating Lithium Ion Battery
Method for Leaching Copper from Copper Sulfide Ore
Method for Vacuum Packing High-Purity Tin and Vacuum-Packed High Purity Tin
Surface Treated Copper Foil, Copper Foil with Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device
Cu-Ni-Sn Based Copper Alloy Foil, Copper Rolled Product, Electronic Device Parts and Autofocus Camera Module
Processing Method for Lithium Ion Battery Scrap
Copper Alloy Sheet Material and Method for Producing Copper Alloy Sheet Material
Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device
Method for Manufacturing Sputtering Target
Copper Foil for Producing Graphene and Method of Producing Graphene Using the Same
Patent:
47,195 →
Application:
15/432,383 →
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 30, 2012
From: SANO, MASAKI; ABE, YOSHIFUMI; HATANO, KAZUHIRO; KATSUKAWA, KOJI
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 028284/0967 →
Assignment of Assignor's Interest
Jul 31, 2012
From: MAEDA, NAOFUMI
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 028681/0514 →
Corrective Assignment to Correct the Conveying Party Name Recorded at Reel 027329 Frame 0849 with Original Cover Sheet.
Sep 7, 2012
From: KAMMURI, KAZUKI
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 029162/0561 →
Assignment of Assignor's Interest
Sep 27, 2012
From: OKAFUJI, YASUHIRO
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 029036/0783 →
Assignment of Assignor's Interest
Oct 1, 2012
From: OOKUBO, MITSUHIRO
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 029057/0402 →
Assignment of Assignor's Interest
Nov 19, 2012
From: KUWANO, KENICHI; ABE, ATSUKO; MANABE, MANABU; MIURA, AKIRA
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 029320/0646 →
Assignment of Assignor's Interest
Feb 10, 2014
From: CHIBA, YOSHIHIRO; YAMAJI, TATSUYA
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 032185/0021 →
Assignment of Assignor's Interest
Sep 22, 2014
From: SHIBUYA, YOSHITAKA; FUKAMACHI, KAZUHIKO; KODAMA, ATSUSHI
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 033790/0012 →
Change of Address
Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
Change of Address
Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057453/0937 →