Patent Assignment
Reel/Frame 057453/0937
Change of Address
Recorded: 2021-08-11
Pages: 15
Assignor
JX NIPPON MINING & METALS CORPORATION
Executed: 2016-01-01
Assignee
JX NIPPON MINING & METALS CORPORATION
1-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8164, JAPAN
Covered Properties
(125)
Copper alloy sputtering target and method for manufacturing the target
Sputtering Target, Sputtering Target-Backing Plate Assembly and Deposition System
Ruthenium-Alloy Sputtering Target
Method for Connecting Magnetic Substance Target to Backing Plate, and Magnetic Substance Target
Target formed of Sintering-Resistant Material of High-Melting Point Metal Alloy, High-Melting Point Metal Silicide, High-Melting Point Metal Carbide, High-Melting Point Metal Nitride, or High-Melting Point Metal Boride, Process for Producing the Target, Assembly of the Sputtering Target-Backing Plate, and Process for Producing the Same
Process for Recovery of Copper from Copper-Containing Chloride Media
Copper Alloy Sputtering Target, Process for Producing the Same and Semiconductor Element Wiring
Fuel Cell Separator Material, Fuel Cell Separator Using Same, and Fuel Cell Stack
Metal Foil with Carrier
Ni-Si-Co COPPER ALLOY AND MANUFACTURING METHOD THEREFOR
Tantalum Sputtering Target
Electromagnetic Shielding Material and Method of Producing Electromagnetic Shielding Material
Tantalum Sputtering Target
Oxide Sintered Compact, Its Production Method, and Raw Material Powder for Producing Oxide Sintered Compact
Method of Leaching Copper and Gold from Sulfide Ores
Process of Treatment for Oxidizing an Acidic Solution Containing an Iodide Ion and an Iron (Ii) Ion
Method of Recovering Gold from Dilute Gold Solution
Process of Leaching Gold
Reflow Sn Plated Material
Gadolinium Sputtering Target and Production Method of Said Target
Copper Foil Composite
Copper Foil for Printed Circuit
Cu-Co-Si Alloy Material
Cu-Ni-Si-Co Copper Alloy for Electronic Material and Process for Producing Same
Cu-Ni-Si Alloy for Electronic Material
Cu-Si-Co Alloy for Electronic Materials, and Method for Producing Same
Method for Processing Acidic Solution That Contains Iodide Ions and Iron Ions
Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIALS, AND METHOD OF MANUFACTURING SAME
Method of Leaching Copper Ore
Sputtering Target and/or Coil, and Process for Producing Same
Copper-Cobalt-Silicon Alloy for Electrode Material
Indium Sputtering Target And Method For Manufacturing Same
Fe-Pt-Based Sputtering Target with Dispersed C Grains
Sputtering Target-Backing Plate Assembly and Method for Producing Same
Sputtering Target for Magnetic Recording Film
Copper Foil for Printed Wiring Board
Cu-Ga Target, Method of Producing Same, Light-absorbing Layer Formed from Cu-Ga Based Alloy Film, and CIGS System Solar Cell Having the Light-absorbing Layer
Sputtering Target for Magnetic Recording Film and Process for Production Thereof
Method for Leaching Copper from Copper Sulfide Ore
Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIALS AND MANUFACTURING METHOD THEREOF
Copper or Copper Alloy, Bonding Wire, Method of Producing the Copper, Method of Producing the Copper Alloy, and Method of Producing the Bonding Wire
Metal Foil Provided with Electrically Resistive Layer, and Board for Printed Circuit Using Said Metal Foil
Cu-Si-Co-BASED COPPER ALLOY FOR ELECTRONIC MATERIALS AND METHOD FOR PRODUCING THE SAME
STRIP OF Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIALS AND THE METHOD FOR PRODUCING THE SAME
Copper Alloy Sheet with Excellent Heat Dissipation and Workability in Repetitive Bending
Copper Foil Composite, Copper Foil Used for the Same, Formed Product and Method of Producing the Same
Copper Foil for Producing Graphene and Method of Producing Graphene Using the Same
Copper Foil for Producing Graphene and Method of Producing Graphene Using the Same
High-Purity Yttrium, Process of Producing High-Purity Yttrium, High-Purity Yttrium Sputtering Target, Metal Gate Film Deposited with High-Purity Yttrium Sputtering Target, and Semiconductor Element and Device Equipped with the Metal Gate Film
Material Fuel Cell Separator, Fuel Cell Separator Using Same, Fuel Cell Stack, and Method of Producing Fuel Cell Separator Material
Indium Oxide Transparent Conductive Film
Surface Treated Copper Foil and Laminate Using the Same, Printed Wiring Board, and Copper Clad Laminate
Metal Material for Electronic Component and Method for Manufacturing the Same
Sputtering Target and Manufacturing Method Therefor
Titanium Target for Sputtering
Copper Foil for Producing Graphene and Method of Producing Graphene Using the Same
Sintered Compact Magnesium Oxide Target for Sputtering, and Method for Producing Same
Magnetic Material Sputtering Target and Manufacturing Method Thereof
High-Purity Copper-Chromium Alloy Sputtering Target
Ferromagnetic Material Sputtering Target Containing Chromium Oxide
High Purity Manganese and Method for Producing Same
Copper Foil Composite, Formed Product and Method of Producing the Same
Copper Foil Composite, Formed Product and Method of Producing the Same
High-Purity Copper Sputtering Target
High-Purity Titanium Ingots, Manufacturing Method Therefor, and Titanium Sputtering Target
Co-Cr-Pt-Based Sputtering Target and Method for Producing Same
Polycrystalline Silicon Sputtering Target
Press-Fit Terminal and Electronic Component Using the Same
Indium Cylindrical Sputtering Target And Manufacturing Method Thereof
Magnetic Material Sputtering Target and Manufacturing Method for Same
Neodymium-Based Rare Earth Permanent Magnet and Process for Producing Same
Tungsten Sintered Compact Sputtering Target and Tungsten Film Formed Using Same Target
Sputtering Target for Magnetic Recording Medium, and Process for Producing Same
Sputtering Target for forming Magnetic Recording Film and Process for Producing Same
Fe-Based Magnetic Material Sintered Compact
Tantalum Sputtering Target, Method for Manufacturing Same, and Barrier Film for Semiconductor Wiring Formed by Using Target
Metallic Material for Electronic Components, and Connector Terminals, Connectors and Electronic Components Using Same
Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board
Surface-Treated Copper Foil
Cu-Ni-Si BASED COPPER ALLOY
Ruthenium Sputtering Target and Ruthenium Alloy Sputtering Target
Metallic Material For Electronic Components And Method For Producing Same, And Connector Terminals, Connectors And Electronic Components Using Same
Metallic Material For Electronic Components And Method For Producing Same, And Connector Terminals, Connectors And Electronic Components Using Same
Metallic Material For Electronic Components And Method For Producing Same, And Connector Terminals, Connectors And Electronic Components Using Same
Ultrathin Copper Foil And Method Of Manufacturing The Same, And Ultrathin Copper Layer
Fe-Pt Based Magnetic Material Sintered Compact
Cathode Active Material For Lithium-Ion Battery, Cathode For Lithium-Ion Battery and Lithium-Ion Battery
Metallic Material for Electronic Components and Method for Producing Same, and Connector Terminals, Connectors and Electronic Components Using Same
NbO2 Sintered Compact, Sputtering Target Comprising the Sintered Compact, and Method of Producing NbO2 Sintered Compact
Electronic Component Metal Material and Method for Manufacturing the Same
Electronic Component Metal Material and Method for Manufacturing the Same
Tantalum Sputtering Target and Method for Producing Same
Tantalum Sputtering Target and Method for Producing Same
Copper Alloy Sputtering Target
Camera Module and Titanium-Copper Foil
Carrier-Attached Copper Foil
Tungsten Sintered Compact Sputtering Target and Method for Producing Same
Tantalum Sputtering Target and Production Method Therefor
Rolled Copper Foil for Producing Two-Dimensional Hexagonal Lattice Compound and Method of Producing Two-Dimensional Hexagonal Lattice Compound
High-Purity Copper-Cobalt Alloy Sputtering Target
Titanium Target for Sputtering and Manufacturing Method Thereof
Backing Plate-Integrated Metal Sputtering Target and Method of Producing Same
Sputtering Target-Backing Plate Assembly
High-Strength Titanium Copper Foil and Method for Producing Same
High-Strength Titanium Copper Foil and Method for Producing Same
Sputtering Target And Method For Production Thereof
Metal Foil for Electromagnetic Shielding, Electromagnetic Shielding Material, and Shielding Cable
Metal Foil for Electromagnetic Shielding, Electromagnetic Shielding Material, and Shielding Cable
Method of Producing Low Alpha-Ray Emitting Bismuth, and Low Alpha-Ray Emitting Bismuth
High Purity Cobalt Chloride and Manufacturing Method Therefor
Surface-Treated Copper Foil, Copper Foil with Carrier, Substrate, Resin Substrate, Printed Wiring Board, Copper Clad Laminate and Method for Producing Printed Wiring Board
Surface-Treated Copper Foil, Copper Foil with Carrier, Substrate, Resin Substrate, Printed Wiring Board, Copper Clad Laminate and Method for Producing Printed Wiring Board
Tantalum Sputtering Target
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board
Method for Electrolytically Refining Lead in Sulfamate Bath
Titanium-Copper Alloy Having Plating Layer
Copper Foil Provided with Carrier, Laminate, Printed Wiring Board, and Method for Fabricating Printed Wiring Board
Magnetic Material Sputtering Target and Method for Producing Same
Laminate Structure and Manufacturing Method Thereof
Copper Foil with Carrier
Copper Foil for Printed Circuit
Method for Producing High-Purity Calcium
Indium Oxide Transparent Conductive Film
Magnetic Material Sputtering Target and Manufacturing Method Thereof
Copper Alloy Sputtering Target and Semiconductor Element Wiring
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.
Corrective Assignment to Correct the Conveying Party Name Recorded at Reel 027329 Frame 0849 with Original Cover Sheet.
Sep 7, 2012
From: KAMMURI, KAZUKI
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 029162/0561 →
Change of Address
Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →