Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board

1. A surface-treated copper foil, wherein a surface treated layer is formed on a copper foil, wherein the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 μm.

2. The surface-treated copper foil according to claim 1 , wherein at least one of the following (1) to (4) is satisfied:

(1) the surface-treated layer is a roughening-treated layer,

(2) the surface-treated layer is a roughening-treated layer, and the surface-treated copper foil has, on the surface of the roughening-treated layer, one or more layers selected from the group consisting of a heat resistant layer, a rust-preventing layer, a chromate-treated layer and a silane coupling treated layer,

(3) the surface-treated layer is one or more layers selected from the group consisting of a roughening-treated layer, a heat resistant layer, a rust-preventing layer, a chromate-treated layer and a silane coupling treated layer, or

(4) the surface-treated layer is provided with a resin layer on the surface-treated layer.

3. A copper foil with carrier, comprising on one side or both sides of the carrier, an intermediate layer and an ultra-thin copper layer in this order, wherein the ultra-thin copper layer is the surface-treated copper foil according to claim 1 , and optionally the surface-treated copper foil comprises a resin layer on the surface treated layer.

4. The surface-treated copper foil according to claim 1 , wherein at least one of the following (1) or (2) is satisfied:

(1) the surface roughness Sz of the surface of the surface-treated layer is 2 to 3.23 μm,

(2) the ratio B/A of the three-dimensional surface area B to the two-dimensional surface area A of the surface of the surface-treated layer is 1.01 to 1.2401.

5. The surface-treated copper foil according to claim 1 , wherein the ratio B/A of the three-dimensional surface area B to the two-dimensional surface area A of the surface of the surface-treated layer is 1.05 to 1.8.

6. A method for producing a copper clad laminate comprising:

a step of preparing the surface-treated copper foil according to claim 1 , or a copper foil with carrier comprising a carrier, an intermediate layer and an ultra-thin copper layer in this order, the ultra-thin copper layer being the surface-treated copper foil of claim 1 , and

a step of laminating the surface-treated copper foil or the copper foil with carrier on an insulating substrate.

7. A method for producing a printed wiring board comprising:

a step of preparing the surface-treated copper foil according to claim 1 , or a copper foil with carrier comprising a carrier, an intermediate layer and an ultra-thin copper layer in this order, the ultra-thin copper layer being the surface-treated copper foil of claim 1 , and

a step of producing a printed wiring board with the surface-treated copper foil or the copper foil with carrier.

8. A method for producing an electronic device comprising:

a step of producing the printed wiring board by the method according to claim 7 , and

a step of producing an electronic device with the printed wiring board.

9. A method for producing a printed wiring board, comprising:

a step of preparing the following (a) or (b), and (c) or (d),

(a) the surface-treated copper foil according to claim 1 , the surface-treated copper foil optionally having a resin layer on the surface-treated layer thereof,

(b) a copper foil with carrier comprising a carrier, an intermediate layer, an ultra-thin copper layer and optionally a resin layer in this order, the ultra-thin copper layer being the surface-treated copper foil of claim 1 ,

(c) an insulating substrate,

(d) a resin layer formed with a metal foil or a copper foil with carrier;

a step of laminating the surface-treated copper foil, via the surface-treated layer side thereof, on the insulating substrate or the resin layer, or a step of laminating the copper foil with carrier, via the ultra-thin copper layer side thereof, on the insulating substrate or the resin layer, and then, peeling the carrier of the copper foil with carrier;

a step of removing the surface-treated copper foil on the insulating substrate or the resin layer, or a step of removing the ultra-thin copper layer on the insulating substrate or the resin layer after the peeling of the carrier; and

a step of forming a circuit on the surface of the insulating substrate or the resin layer with the surface-treated copper foil or the ultra-thin copper layer removed therefrom.

10. A method for producing a printed wiring board, comprising:

a step of preparing the following (e) or (f), and (g) or (h),

(e) the surface-treated copper foil according to claim 1 ,

(f) a copper foil with carrier comprising a carrier, an intermediate layer and an ultra-thin copper layer in this order, the ultra-thin copper layer being the surface-treated copper foil of claim 1 ,

(g) an insulating substrate,

(h) a resin layer formed with a metal foil or a copper foil with carrier;

a step of forming a copper clad laminate by laminating the surface-treated copper foil, via the surface-treated layer side thereof, on the insulating substrate or on the resin layer, or by laminating the copper foil with carrier, via the ultra-thin copper layer side thereof, on the insulating substrate or on the resin layer, and then, peeling the carrier of the copper foil with carrier; and

a step of subsequently forming a circuit by a semi-additive method, a subtractive method, a partly additive method or a modified semi-additive method.

11. A method for producing a printed wiring board, comprising:

a step of preparing the surface-treated copper foil according to claim 1 , with a circuit formed on the surface-treated layer formed side, or a copper foil with carrier comprising a carrier, an intermediate layer and an ultra-thin copper layer in this order, the ultra-thin copper layer being the surface-treated copper foil of claim 1 , with a circuit formed on the surface thereof on the ultra-thin copper layer side;

a step of forming a resin layer on the surface of the surface-treated copper foil or the surface of the copper foil with carrier so as for the circuit to be embedded;

a step of forming a circuit on the surface of the resin layer; and

a step of exposing the circuit embedded in the resin layer by removing the surface-treated copper foil or the copper foil with carrier.