Patent Assignment
Reel/Frame 038010/0681
Assignment of Assignor's Interest
Recorded: 2016-03-17
Pages: 3
Assignors
ISHII, MASAFUMI
Executed: 2016-02-29
HONDA, MISATO
Executed: 2016-02-29
MIYAMOTO, NOBUAKI
Executed: 2016-02-29
Assignee
JX NIPPON MINING & METALS CORPORATION
6-3, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 1008164, JAPAN
Covered Property
(1)
Surface-Treated Copper Foil, Copper Foil with Carrier, Substrate, Resin Substrate, Printed Wiring Board, Copper Clad Laminate and Method for Producing Printed Wiring Board
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.