Tantalum sputtering target
View Patent ↗A tantalum sputtering target containing niobium and tungsten as essential components in a total amount of 1 massppm or more and less than 10 massppm, and having a purity of 99.9999% or higher excluding niobium, tungsten and gas components. Provided is a high purity tantalum sputtering target comprising a uniform and fine structure which is adjusted to be within an optimal range and which enables deposition of a uniform film at a high deposition rate in a stable manner.
1. A disk-shaped tantalum sputtering target having a recrystallized structure and a diameter of 450 mmφ and containing niobium and tungsten as essential components each in an amount of 1 massppm or more and 5 massppm or less, and having a purity of 99.9999% or higher excluding niobium, tungsten and gas components, wherein an average crystal grain size of the tantalum sputtering target is 50 μm or more and 150 μm or less, variation of the crystal grain size is 20% or less, and variation of contents of the niobium and tungsten in the tantalum sputtering target is 30% or less, and wherein the variation of the crystal grain size is defined as a percentage determined by measuring the crystal grain size of the tantalum sputtering target at a total of 9 points, including a center point of the target, four points at half radius of the target, and four points adjacent an outer periphery of the target, and by calculating a variation thereof with a formula of ((maximum value−minimum value)/(maximum value+minimum value))×100.