IP Library Granted Patent US 9,992,874
Granted Patent B2
US 9,992,874 · App. 13/132,766 · Granted Jun 5, 2018

Metal foil with carrier

Inventor: Masayuki Takamori (Tokyo, JP)
Assignee: JX Nippon Mining & Metals Corporation
H05K3/025H05K3/4652H05K2203/0152H05K2203/0285Y10T428/31678
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,992,874
App. No.
13/132,766
Granted
Jun 5, 2018
Kind
B2
Abstract

Provided is a metal foil with a carrier as a laminated body in which a carrier A and a metal foil B are placed alternately, wherein the carrier A and the metal foil B respectively have a glossy surface, so-called ‘S surface’, and the said surfaces are laminated to face each other. The present invention relates to a copper foil with a carrier which is used for producing a single-sided laminated plate or a multilayer laminated plate of two or more layers for use in a printed wiring board. In particular, this copper foil with a carrier is used for producing a laminated plate, and its objective is to improve the handling performance during the production process of a printed board and reduce costs by increasing the yield.

Claims (5)

1. A metal foil with a carrier as a laminated body, comprising a carrier A and a metal foil B, wherein the carrier A and the metal foil B respectively have a glossy surface S, said surfaces S of the carrier A and the metal foil B are laminated to face each other, wherein the carrier A protrudes and extends beyond a peripheral edge of the metal foil B, wherein the carrier A is ultrasonically bonded directly to the metal foil B at two separate equally extending continuous weldings, one of said weldings extending adjacent the peripheral edge of the metal foil B from which the carrier A protrudes and the other of said weldings extending adjacent an opposite peripheral edge of the metal foil B, the carrier A being mechanically peelable from the metal foil B.

2. A laminated body comprising the metal foil with a carrier according to claim 1 , further comprising a first prepreg laminated on the metal foil with carrier, a two-layer printed circuit board laminated on the first prepreg, a second prepreg laminated on the two-layer printed circuit board and a second metal foil with carrier according to claim 1 formed on the second prepreg.

3. The metal foil with a carrier according to claim 1 , wherein the metal foil B is a copper foil or a copper alloy foil.

4. The metal foil with a carrier according to claim 1 , wherein the carrier A and the metal foil B are rectangular.

5. The metal foil with a carrier according to claim 4 , wherein the metal foil B is a copper foil or a copper alloy foil.

Assignments (3)
CHANGE OF ADDRESS Recorded Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057453/0937 →
CHANGE OF ADDRESS Recorded Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2011
From: TAKAMORI, MASAYUKI
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 026393/0482 →
Priority Claims (1)
JP 2008-327457 · Dec 24, 2008 · national
Continuity (1)
Related Publication 20110244255A1 · Oct 6, 2011