Strip of Cu—Co—Si-based copper alloy for electronic materials and the method for producing the same

1. A copper alloy strip for electronic materials comprising 0.5-2.5 mass % of Co, 0.1-0.7 mass % of Si, optionally containing 1.0 mass % or less of Ni, further optionally containing at least one element selected from the group consisting of Cr, Mg, P, As, Sb, Be, B, Mn, Sn, Ti, Zr, Al, Fe, Zn and Ag in an amount not exceeding 2.0 mass % in total, the balance Cu and inevitable impurities, wherein, from a result obtained from measurement of an X ray diffraction pole figure, using a rolled surface as a reference plane, the following (a) is satisfied:

(a) a diffraction peak height at β angle=120° among diffraction peak intensities by β scanning at α=25° in a {200} pole figure is at least 10 times that of standard copper powder; and

wherein the following formula is satisfied, where Co content (mass %) is expressed by [Co] and spring bending elastic limit is expressed by Kb (MPa):

60×[Co]+265≦Kb≦60×[Co]+375; and  Formula c:

wherein a hanging curl in a direction parallel with a rolling direction is 35 mm or less.

2. The copper alloy strip according to claim 1 , wherein the following formula is satisfied, where Co content (mass %) is expressed by [Co] and 0.2% yield strength is expressed by YS (MPa):

−55×[Co] 2 +250×[Co]+500≧YS≧−55×[Co] 2 +250×[Co]+350.  Formula a:

3. The copper alloy strip according to claim 1 , wherein the following formulae are satisfied, where the 0.2% yield strength is expressed by YS (MPa) and the electrical conductivity is expressed by EC (% IACS):

500≦YS≦800, 50≦EC≦75 and

−0.117×[YS]+130≦EC≦−0.117×[YS]+154.  Formula b:

4. A method for producing a copper alloy strip according to claim 1 , which comprises steps in the following sequence:

step 1 of melting and casting an ingot having a composition as claimed in claim 1 ;

step 2 of heating the ingot at 900° C.-1050° C. for at least 1 hour, and thereafter subjecting it to a hot rolling;

step 3 of cold rolling;

step 4 of conducting solution treatment at 850-1050° C. and then cooling with an average cooling rate to 400° C. of at least 10° C./sec;

multi-stage aging step 5 comprising a first stage of heating the material at 480° C.-580° C. for 1-12 hours, then a second stage of heating the material at 430-530° C. for 1-12 hours, and then a third stage of heating the material at 300-430° C. for 4-30 hours, wherein the cooling rates from the first stage to the second stage and from the second stage to the third stage are at least 0.1° C./min respectively, and a temperature difference between the first stage and the second stage is 20-80° C. and a temperature difference between the second stage to the third stage is 20-180° C. and wherein the multiple stage aging is performed in a batch furnace with the material in a coiled condition, and

step 6 of cold rolling.

5. The method for producing a copper alloy strip according to claim 4 , wherein, after the step 6, a thermal refining annealing step is carried out by heating the material at a temperature of 200-500° C. for 1-1000 seconds.

6. A wrought copper product comprising the copper alloy strip as claimed in claim 1 .

7. An electronic component comprising the copper alloy strip as claimed in claim 1 .