Copper foil composite, copper foil used for the same, formed product and method of producing the same
View Patent ↗A copper foil composite comprising a copper foil and a resin layer laminated, the copper foil containing at least one selected from the group consisting of Sn, Mn, Cr, Zn, Zr, Mg, Ni, Si and Ag at a total of 30 to 500 mass ppm, a tensile strength of the copper foil having of 100 to 180 MPa, a degree of aggregation I200/I 0 200 of a (100) plane of the copper foil being 30 or more, and an average grain size viewed from a plate surface of the copper foil being 10 to 400 μm.
1. A copper foil composite comprising a copper foil and a resin layer laminated thereto, the copper foil containing at least one element selected from the group consisting of Sn, Mn, Cr, Zn, Zr, Mg, Ni, Si and Ag at a total of 30 to 500 mass ppm, and the rest being Cu and unavoidable impurities, a tensile strength of the copper foil being 100 to 180 MPa, a degree of aggregation I200/I0200 of a (200) plane of the copper foil being 30 or more, and an average grain size viewed from a plate surface of the copper foil being 50 to 400 μm, and further wherein when the copper foil composite is tested for 180° intimate bending according to JIS Z 2248 and a part is bent at 180° and returned to 0° five times, the copper foil is not cracked and has no necking, or the copper foil has small wrinkles, but no large wrinkles.
2. The copper foil composite according to claim 1 , wherein fracture strain of the copper foil being 5% or more, and (F×T)/(f×t)≥1 is satisfied, where t is a thickness of the copper foil, f is a stress of the copper foil under tensile strain of 4%, T is a thickness of the resin layer, and F is a stress of the resin layer under tensile strain of 4%.
3. A copper foil, used for the copper foil composite according to claim 1 .
4. A formed product, provided by working the copper foil composite according to claim 1 .
5. A method of producing a formed product, comprising working the copper foil composite according to claim 1 .