Cu—Ni—Si—Co copper alloy for electronic material and process for producing same
View Patent ↗A Cu—Ni—Si—Co system alloy having an improved spring bending elastic limit is provided. The alloy is a copper alloy for electronic materials, which contains 1.0% to 2.5% by mass of Ni, 0.5% to 2.5% by mass of Co, and 0.3% to 1.2% by mass of Si, with the balance being Cu and unavoidable impurities, wherein from the results obtainable by an X-ray diffraction pole figure analysis using a rolled surface as a base, among the diffraction peak intensities of the {111}Cu plane with respect to the {200}Cu plane obtained by β scanning at α=35°, the peak height at a β angle of 90° of the copper alloy is at least 2.5 times the peak height of a standard copper powder.
1. A copper alloy for electronic materials, comprising 1.0% to 2.5% by mass of Ni, 0.5% to 2.5% by mass of Co, and 0.3% to 1.2% by mass of Si, optionally 0.03% to 0.5% by mass of Cr, and optionally at least one member selected from the group consisting of Mg, P, As, Sb, Be, B, Mn, Sn, Ti, Zr, Al, Fe, Zn and Ag in a total amount of 2.0% by mass at the maximum, with the balance being Cu and unavoidable impurities, wherein from the results obtainable by an X-ray diffraction pole figure analysis using a rolled surface as a base, among the diffraction peak intensities of the {111}Cu plane with respect to the {200}Cu plane obtained by β scanning at α=35°, the peak height at a β angle of 90° of the copper alloy is at least 2.5 times the peak height of a standard copper powder,
wherein the copper alloy satisfies the following formula:
20×(Ni concentration+Co concentration)+625≧Kb≧20×(Ni concentration+Co concentration)+520 Formula B
wherein the unit of Ni concentration and the unit of Co concentration is percent (%) by mass, and Kb represents spring bending elastic limit.
2. The copper alloy according to claim 1 , wherein the number density of particles having a particle size of from 0.1 μm to 1 μm among second phase particles precipitated in a matrix phase is 5×10 5 to 1×10 7 particles/mm 2 .
3. The copper alloy according to claim 1 , satisfying the following formula:
−14.6×(Ni concentration+Co concentration) 2 +165×(Ni concentration+Co concentration)+544 ≧YS≧− 14.6×(Ni concentration+Co concentration) 2 +165×(Ni concentration+Co concentration)+512.3 Formula A
wherein the unit of the Ni concentration and the Co concentration is percent (%) by mass and YS represents 0.2% yield strength.
4. The copper alloy according to claim 1 , wherein the relationship between Kb and YS satisfies the following formula:
0.23 ×YS+ 480 ≧Kb≧ 0.23 ×YS+ 390 Formula C
wherein YS represents 0.2% yield strength; and Kb represents spring bending elastic limit.
5. The copper alloy according to claim 1 , wherein the ratio of the total mass concentration of Ni and Co to the mass concentration of Si, [Ni+Co]/[Si], satisfies the relationship: 4≦[Ni+Co]/Si≦5.
6. The copper alloy according to claim 1 , further comprising Cr: 0.03% to 0.5% by mass.
7. The copper alloy according to claim 1 , further comprising at least one selected from the group consisting of Mg, P, As, Sb, Be, B, Mn, Sn, Ti, Zr, Al, Fe, Zn and Ag in a total amount of 2.0% by mass at the maximum.
8. A method for producing a copper alloy according to claim 1 , the method comprising the following steps, in order:
(1) melting and casting an ingot of a copper alloy having the composition according to claim 1 ;
(2) heating the material for one hour or longer at a temperature of from 950° C. to 1050° C., subsequently performing hot rolling, adjusting the temperature at the time of completion of hot rolling to 850° C. or higher, and cooling the material with an average cooling rate from 850° C. to 400° C. at 15° C./s or greater;
(3) performing cold rolling;
(4) conducting a solution heat treatment at a temperature of from 850° C. to 1050° C., and cooling the material with an average cooling rate to 400° C. at 10° C. or more per second;
(5) conducting a first aging treatment involving multistage aging, which includes a first stage of heating the material at a material temperature of 400° C. to 500° C. for 1 to 12 hours, subsequently a second stage of heating the material at a material temperature of 350° C. to 450° C. for 1 to 12 hours, and subsequently a third stage of heating the material at a material temperature of 260° C. to 340° C. for 4 to 30 hours, wherein the cooling rate from the first stage to the second stage and the cooling rate from the second stage to the third stage is set at 1° C. to 8° C./min, respectively, the temperature difference between the first stage and the second stage is adjusted to 20° C. to 60° C., and the temperature difference between the second stage and the third stage is adjusted to 20° C. to 180° C.;
(6) performing cold rolling; and
(7) conducting a second aging treatment at a temperature of higher than or equal to 100° C. and lower than 350° C. for 1 to 48 hours.
9. The method according to claim 8 , wherein after the solution heat treatment in step (4), instead of the cooling conditions of cooling to 400° C. at an average cooling rate of 10° C. or more per second, cooling is carried out at an average cooling rate of greater than or equal to 1° C./s and less than 15° C./s until the material temperature falls to 650° C., and at an average cooling rate of 15° C./s or greater until the temperature falls from 650° C. to 400° C.
10. The method according to claim 8 , further comprising a step (8) of performing acid pickling and/or polishing, after step (7).
11. A wrought copper product made of the copper alloy according to claim 1 .
12. An electronic component comprising the copper alloy according to claim 1 .