IP Library › Granted Patent US 9,930,776

Granted Patent B2

US 9,930,776 · App. 14/412,834 · Granted Mar 27, 2018

Ultrathin copper foil and method of manufacturing the same, and ultrathin copper layer

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Quick Facts

Patent No.: US 9,930,776
App. No.: 14/412,834
Granted: Mar 27, 2018
Kind: B2

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Abstract

Provided is an ultrathin copper foil which has improved thickness accuracy of an ultrathin copper layer on a supporting copper foil. An ultrathin copper foil which is provided with a supporting copper foil, a releasing layer that is laminated on the supporting copper foil, and an ultrathin copper layer that is laminated on the releasing layer. The thickness accuracy of the ultrathin copper layer as determined by a weight thickness method is 3.0% or less.

Claims (123)

1. An ultrathin copper foil comprising a supportive copper foil, a release layer superposed on the supportive copper foil, and an ultrathin copper layer superposed on the release layer, wherein

the thickness of the ultrathin copper layer is 12 μm or less;

the accuracy of the thickness of the ultrathin copper layer is 3.0% or less, determined by a weight method comprising:

punching out from the ultrathin copper foil sixty 3 cm×3 cm samples, which samples are obtained by punching the ultrathin copper foil in a pattern determined by 6 rows of 10 equally spaced punch locations where the rows extend in the width direction of the ultrathin copper foil and adjacent rows are separated by a distance of 4 cm,

for each of the sixty samples:

measuring the total weight of the ultrathin copper layer and the supportive copper foil layer in the sample;

peeling away the ultrathin copper layer from the supportive copper foil layer in the sample;

weighing the supportive copper foil layer thus separated from the ultrathin copper layer in the sample, and determining the weight of the ultrathin copper layer in the sample by subtracting the weight of the supportive copper foil layer from the total weight of the ultrathin copper layer and the supportive copper foil layer;

calculating the accuracy of thickness of the ultrathin copper layer by the equation:

Accuracy in thickness (%)=3σ×100/mean

wherein σ is the standard deviation and “mean” is the mean deviation of the weights of the ultrathin copper layer in the samples.

2. An ultrathin copper foil comprising a supportive copper foil, a release layer superposed on the supportive copper foil, and an ultrathin copper layer superposed on the release layer, wherein

the thickness of the ultrathin copper layer is 12 μm or less;

the accuracy of the thickness of the ultrathin copper layer measured with a four-point probe method is 10.0% or less, the four point probe method comprising:

measuring the resistivity of the ultrathin copper foil with a four point probe at 280 measurement points spaced 5 mm apart in the width direction of the ultrathin copper foil;

calculating a thickness of the ultrathin copper foil by using the resistivity of the ultrathin copper foil;

peeling away the ultrathin copper foil layer from the supportive copper foil in the ultrathin copper foil;

redetermining the resistivity of the supportive copper foil at the 280 measurement points;

calculating a thickness of the supportive copper foil by using the resistivity of supportive copper foil;

comparing the thickness of the ultrathin copper foil and the thickness of the supportive copper foil at each measurement point, the difference between the thickness of the ultrathin copper foil and the thickness of the supportive copper foil at each measurement point being the thickness of the ultrathin copper layer at each measurement point;

calculating the accuracy of thickness of the ultrathin copper layer by the equation:

Accuracy in thickness (%)=3σ×100/mean

wherein σ is the standard deviation and “mean” is the mean deviation of the thickness of the ultrathin copper layer at the measuring points.

3. The ultrathin copper foil according to claim 1 , having a surface roughened layer of coarse particles on the surface of the ultrathin copper layer.

4. A method of manufacturing an ultrathin copper foil comprising a supportive copper foil, a release layer superposed on the supportive copper foil, and an ultrathin copper layer superposed on the release layer according to claim 1 by treating the surface of the supportive copper foil conveyed in a length direction with a roll-to-roll conveying system, comprising:

a step of forming the release layer on the surface of the supportive copper foil conveyed by a conveying roller;

a step of forming an ultrathin copper layer on the surface of the release layer by electrolytic plating while supporting with a drum the supportive copper foil on which the release layer is formed and which is conveyed by a conveying roller; and

a step of determining the accuracy of the thickness of the ultrathin copper layer by the weight method comprising:

for each of the sixty samples:

measuring the total weight of the ultrathin copper layer and the supportive copper foil layer in the sample;

peeling away the ultrathin copper layer from the supportive copper foil layer in the sample;

calculating the accuracy of thickness of the ultrathin copper layer by the equation:

Accuracy in thickness (%)=3σ×100/mean

wherein σ is the standard deviation and “mean” is the mean deviation of the weights of the ultrathin copper layer in the samples.

5. The manufacture method of an ultrathin copper foil according to claim 4 , wherein the step of forming the release layer is performed by forming the release layer on the surface of the supportive copper foil while supporting with a drum the supportive copper foil conveyed by a conveying roller.

6. The manufacture method of the ultrathin copper foil according to claim 4 or 5 , further comprising a step of forming a surface roughened layer of coarse particles on the surface of the ultrathin copper layer of the supportive copper foil conveyed by a conveying roller.

7. The manufacture method of the ultrathin copper foil according to claim 4 , further comprising a step of forming a surface roughened layer of coarse particles on the surface of the ultrathin copper layer by electrolytic plating while supporting with a drum the supportive copper foil conveyed by a conveying roller.

8. An ultrathin copper layer comprising an electrolytic copper foil superposed on a release layer superposed on a supportive copper foil and constituting, together with the supportive copper foil and the release layer, an ultrathin copper foil, wherein

the thickness of the ultrathin copper layer is 12 μm or less;

the accuracy of the thickness of the ultrathin copper layer is 3.0% or less, determined by a weight method comprising:

for each of the sixty samples:

measuring the total weight of the ultrathin copper layer and the supportive copper foil layer in the sample;

peeling away the ultrathin copper layer from the supportive copper foil layer in the sample;

calculating the accuracy of thickness of the ultrathin copper layer by the equation:

Accuracy in thickness (%)=3σ×100/mean

wherein σ is the standard deviation and “mean” is the mean deviation of the weights of the ultrathin copper layer in the samples.

9. An ultrathin copper layer comprising an electrolytic copper foil superposed on a release layer superposed on a supportive copper foil, said ultrathin layer constituting, together with the supportive copper foil and the release layer, an ultrathin copper foil, wherein