Tantalum sputtering target and method for producing same
A tantalum sputtering target, wherein, on a sputtering surface of the tantalum sputtering target, an orientation rate of a (200) plane exceeds 70%, an orientation rate of a (222) plane is 30% or less. By controlling the crystal orientation of the target, effects are yielded in that the discharge voltage of the tantalum sputtering target can be reduced so that plasma can be more easily generated, and the voltage drift during deposition can be suppressed.
1. A tantalum sputtering target having a sputtering surface consisting of crystal grains having a (200) plane orientation, crystal grains having a (222) plane orientation, and crystal grains having orientations other than (200) and (222) plane orientations, wherein the sputtering surface has an orientation rate of (200) plane of 70.8% to 84.3% an orientation rate of (222) plane of 9.9% to 20.7%, and a sum of orientation ratios of (110), (211), (310) and (321) planes of 5.8% to 10.9%, where the orientation rates of (200) plane and (222) plane are calculated from measured strengths of X-ray diffraction peaks of specified planes, which are (110), (200), (211), (310), (222) and (321) planes, and are defined respectively as (measured intensity of the peak of (200) plane/JCPDS intensity of (200) plane)/(Σ(measured intensity of one of the specified planes/JCPDS intensity of the same one of the specified planes))×100 and as (measured intensity of the peak of (222) plane/JCPDS intensity of (222) plane)/(Σ(measured intensity of one of the specified planes/JCPDS intensity of the same one of the specified planes))×100, where JCPDS refers to Joint Committee for Powder Diffraction and Σ means the summation of all of the specified planes.
2. A method of producing a tantalum sputtering target, wherein a molten tantalum ingot is subject to forging and recrystallization annealing, and thereafter subject to rolling and heat treatment to form a tantalum sputtering target having a crystal structure providing a sputtering surface consisting of crystal grains having a (200) plane orientation, crystal grains having a (222) plane orientation, and crystal grains having orientations other than (200) and (222) plane orientations, and with an orientation rate of (200) plane of 70.8% to 84.3%, an orientation rate of (222) plane of 9.9% to 20.7%, and a sum of orientation ratios of (110), (211), (310) and (321) planes of 5.8% to 10.9%, where the orientation rates of (200) plane and (222) plane are calculated from measured strengths of X-ray diffraction peaks of specified planes, which are (110), (200), (211), (310), (222) and (321) planes, and are defined respectively as (measured intensity of the peak of (200) plane/JCPDS intensity of (200) plane)/(Σ(measured intensity of one of the specified planes/JCPDS intensity of the same one of the specified planes))×100 and as (measured intensity of the peak of (222) plane/JCPDS intensity of (222) plane)/(Σ(measured intensity of one of the specified planes/JCPDS intensity of the same one of the specified planes))×100, where JCPDS refers to Joint Committee for Powder Diffraction and Σ means the summation of all of the specified planes.
3. The method of producing a tantalum sputtering target according to claim 2 , wherein the rolling is cold rolling performed using a rolling mill roll having a rolling mill roll diameter of 500 mm or less at a rolling speed of 10 m/min or more and a reduction exceeding 80%.
4. The method of producing a tantalum sputtering target according to claim 3 , wherein the heat treatment is performed at a temperature of 900°C. to 1400°C.
5. The method of producing a tantalum sputtering target according to claim 4 , wherein, after the rolling and heat treatment are performed, surface finishing is performed via machining or polishing.
6. The method according to claim 2 , wherein the heat treatment is performed at a temperature of 900°C. to 1400°C.
7. The method of producing a tantalum sputtering target according to claim 2 , wherein, after the rolling and heat treatment are performed, surface finishing is performed via machining or polishing.
8. A tantalum sputtering target having a sputtering surface consisting of crystal grains having a (200) plane orientation, crystal grains having a (222) plane orientation, and crystal grains having orientations other than (200) and (222) plane orientations, wherein the sputtering surface has an orientation rate of (200) plane of 70.8% to 84.3%, an orientation rate of (222) plane of 9.9% to 20.7%, and a sum of orientation rates of (110), ( 211 ), (310) and (321) planes of 5.8% to 10.9%, where the orientation rates are calculated from measured strengths of X-ray diffraction peaks of (110), (200), (211), (310), (222) and (321) planes.