Reflow Sn plated material
View Patent ↗A reflow Sn plated material, comprising: a substrate consisting of Cu or a Cu base alloy, and a reflow Sn layer formed on the surface of the substrate, wherein an orientation index of a (101) plane on the surface of the reflow Sn layer is from 2.0 or more to 5.0 or less.
1. A reflow Sn plated material, comprising:
a substrate consisting of Cu or a Cu base alloy, and
a reflow Sn layer formed on the surface of the substrate,
wherein an orientation index of a (101) plane on the surface of the reflow Sn layer is from 2.0 or more to 5.0 or less.
2. The reflow Sn plated material according to claim 1 , wherein the reflow Sn layer is formed by forming a Cu plated layer on the surface of the substrate, and reflowing an Sn plated layer formed on the surface of the Cu plated layer.
3. The reflow Sn plated material according to claim 1 , wherein a Ni layer is formed between the reflow Sn layer and the substrate.
4. The reflow Sn plated material according to claim 2 , wherein a Ni layer is formed between the reflow Sn layer and the substrate.