IP Library Granted Patent US 9,840,757
Granted Patent B2
US 9,840,757 · App. 14/738,076 · Granted Dec 12, 2017

Rolled copper foil for producing two-dimensional hexagonal lattice compound and method of producing two-dimensional hexagonal lattice compound

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,840,757
App. No.
14/738,076
Granted
Dec 12, 2017
Kind
B2
Abstract

A rolled copper foil for producing a two-dimensional hexagonal lattice compound, including P: 0.01 to 0.21 wt %, Fe: 0.006 wt % or less, and the balance being Cu and inevitable impurities, and having the following relationship: 2.0<=(I/I 0 ) where I is a (111) diffraction intensity determined by an X ray diffraction of a rolled surface after heating at 1000° C. for 30 minutes and I 0 is a (111) diffraction intensity determined by an X ray diffraction of fine powder copper.

Claims (18)

1. A rolled copper foil for producing a two-dimensional hexagonal lattice compound, including 0.01 to 0.21 wt % phosphorous (P) and 0.001 to 0.006 wt % iron (Fe), having a thickness of 5 to 50 μm, and having the following relationship: 2.0≦(I/I 0 ) where I is a (111) diffraction intensity determined by an X ray diffraction of a rolled surface after heating at 1000° C. for 30 minutes and I 0 is a (111) diffraction intensity determined by an X ray diffraction of fine powder copper.

2. The rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 1 , wherein the average crystal grain size is 1000 μm or more after heating at 1000° C. for 30 minutes measured with a cutting method.

3. The rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 1 , wherein when 0.003 mm 2 of a section area is observed, 1 to 60 inclusions each having a 0.1 μm or more of a circle conversion diameter are present.

4. The rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 2 , wherein when 0.015 mm 2 of a section area is observed, 1 to 60 inclusions each having a 0.1 μm or more of a circle conversion diameter are present.

5. The rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 1 , wherein the two-dimensional hexagonal lattice compound is one of graphene and boron nitride.

6. The rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 2 , wherein the two-dimensional hexagonal lattice compound is one of graphene and boron nitride.

7. The rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 3 , wherein the two-dimensional hexagonal lattice compound is one of graphene and boron nitride.

8. The rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 1 , further comprising 0.01 wt % or less in total of one or more of elements selected from the group consisting of Ni, Sn, Mg, Ti and Zr.

9. The rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 2 , further comprising 0.01 wt % or less in total of one or more of elements selected from the group consisting of Ni, Sn, Mg, Ti and Zr.

10. The rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 3 , further comprising 0.01 wt % or less in total of one or more of elements selected from the group consisting of Ni, Sn, Mg, Ti and Zr.

11. The rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 5 , further comprising 0.01 wt % or less in total of one or more of elements selected from the group consisting of Ni, Sn, Mg, Ti and Zr.

12. The rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 1 , which is produced by hot rolling an ingot, annealing and cold rolling repeatedly one time or more, recrystallization annealing, and finally cold rolling, wherein reduction ratio η in the final cold rolling is defined as 1.0≦η<4.5.

13. The rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 2 , which is produced by hot rolling an ingot, annealing and cold rolling repeatedly one time or more, recrystallization annealing, and finally cold rolling, wherein reduction ratio η in the final cold rolling is defined as 1.0≦η<4.5.

14. The rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 3 , which is produced by hot rolling an ingot, annealing and cold rolling repeatedly one time or more, recrystallization annealing, and finally cold rolling, wherein reduction ratio η in the final cold rolling is defined as 1.0≦η<4.5.

15. A method of producing a two-dimensional hexagonal lattice compound using the rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 1 , comprising the steps of:

providing a raw material gas of the two-dimensional hexagonal lattice compound while placing the heated rolled copper foil for producing a two-dimensional hexagonal lattice compound in a predetermined chamber to form the two-dimensional hexagonal lattice compound on a surface of the rolled copper foil for producing a two-dimensional hexagonal lattice compound; and

laminating a transfer sheet on the surface of the two-dimensional hexagonal lattice compound, and etching and removing the rolled copper foil for producing a two-dimensional hexagonal lattice compound while transferring the two-dimensional hexagonal lattice compound to the transfer sheet.

16. The rolled copper foil for producing a two-dimensional hexagonal lattice compound according to claim 1 , wherein the foil comprises 0.001 to 0.005 wt % Fe.

Assignments (3)
CHANGE OF ADDRESS Recorded Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057453/0937 →
CHANGE OF ADDRESS Recorded Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2015
From: CHIBA, YOSHIHIRO
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 036404/0105 →