IP Library Granted Patent US 10,519,558
Granted Patent B2
US 10,519,558 · App. 15/954,289 · Granted Dec 31, 2019

Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatus

Inventors: Tomota Nagaura (Ibaraki, JP); Masafumi Ishii (Ibaraki, JP)
Assignee: JX Nippon Mining & Metals Corporation
C25D3/38C25D7/123H01L21/2885H01L21/4846H01L21/76879H01L21/76898
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Quick Facts
Patent No.
US 10,519,558
App. No.
15/954,289
Granted
Dec 31, 2019
Kind
B2
Abstract

Copper sulfate which includes a Fe with a concentration of 0.08 ppm by mass or less.

Claims (24)

1. Copper sulfate comprising a Fe with a concentration of 0.08 ppm by mass or less.

2. The copper sulfate according to claim 1 , wherein the copper sulfate further comprises any one, any two, any three, any four, or five of the following items (3-1) to (3-5):

(3-1) an in with a concentration of 1.0 ppm by mass or less,

(3-2) a TI with a concentration of 0.05 ppm by mass or less,

(3-3) a Sn with a concentration of 1.0 ppm by mass or less,

(3-4) an Ag with a concentration of 1.0 ppm by mass or less, and

(3-5) an Al with a concentration of 0.2 ppm by mass or less.

3. The copper sulfate according to claim 1 , wherein the copper sulfate further comprises any one, any two, any three, any four, or five of the following items (5-1) to (5-5):

(5-1) an In with a concentration of 0.2 ppm by mass or less,

(5-2) a TI with a concentration of 0.05 ppm by mass or less,

(5-3) a Sn with a concentration of 0.2 ppm by mass or less,

(5-4) an Ag with a concentration of 0.3 ppm by mass or less, and

(5-5) an Al with a concentration of 0.1 ppm by mass or less.

4. The copper sulfate according to claim 1 , wherein the copper sulfate further comprises any one, any two, any three, any four, or five of the following items (7-1) to (7-5):

(7-1) an In with a concentration of 0.2 ppm by mass or less,

(7-2) a TI with a concentration of 0.05 ppm by mass or less,

(7-3) a Sn with a concentration of 0.2 ppm by mass or less,

(7-4) an Ag with a concentration of 0.045 ppm by mass or less, and

(7-5) an Al with a concentration of 0.05 ppm by mass or less.

5. The copper sulfate according to claim 1 , wherein the copper sulfate has a concentration of copper sulfate of between 99.9% by mass or more and 99.999% by mass or less.

6. The copper sulfate according to claim 5 , wherein the copper sulfate has a concentration of copper sulfate of 99.995% by mass or less.

7. The copper sulfate according to claim 1 , wherein the copper sulfate has a concentration of copper sulfate of between 99.9% by mass or more and 99.99% by mass or less and a concentration of metal impurities other than Cu of 30 ppm by mass or less in total.

8. The copper sulfate according to claim 1 , wherein the copper sulfate has a total organic carbon concentration of 10 ppm by mass or less.

9. A copper sulfate solution comprising the copper sulfate according to claim 1 .

Assignments (2)
CHANGE OF ADDRESS Recorded Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2018
From: NAGAURA, TOMOTA; ISHII, MASAFUMI
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 047445/0015 →
Priority Claims (2)
JP 2017-090247 · Apr 28, 2017 · national
JP 2018-019614 · Feb 6, 2018 · national
Continuity (1)
Related Publication 20180312989A1 · Nov 1, 2018