IP Library Granted Patent US 7,824,534
Granted Patent B2
US 7,824,534 · App. 10/588,686 · Granted Nov 2, 2010

Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,824,534
App. No.
10/588,686
Granted
Nov 2, 2010
Kind
B2
Abstract

The object of the present invention is to obtain a low profile electrolytic copper foil with a low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum and, particularly, to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution contains, as an additive, a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.

Claims (10)

1. A copper electrolytic solution containing copper and an additive selected from the group consisting of at least one compound represented by chemical formulae (2) through (9) below, which is obtained by an addition reaction in which water is added to a compound having in a molecule at least one epoxy group:

wherein n is an integer of 1 to 5;

wherein n 1 is an integer of 1 to 22; and

wherein n 2 is an integer of 1 to 3.

2. A copper electrolytic solution according to claim 1 , wherein said copper electrolytic solution further contains an organic sulfur compound.

3. The copper electrolytic solution according to claim 2 , wherein said organic sulfur compound is selected from the group consisting of compounds represented by formula (10) and (11) below:

X—R 1 —(S) n —R 2 —Y  (10)

R 4 —S—R 3 —SO 3 Z  (11)

wherein in formulae (10) and (11), R 1 , R 2 and R 3 are alkylene groups with 1 through 8 carbon atoms, R 4 is selected from the group consisting of hydrogen,

X is selected from the group consisting of hydrogen, a sulfonic acid group, a phosphonic acid group, an alkali metal salt group and an ammonium salt group of an acid selected from the group consisting of sulfonic acid and phosphonic acid, Y is selected from the group consisting of a sulfonic acid group, a phosphonic acid group and an alkali metal salt group of an acid selected from the group consisting of sulfonic acid and phosphonic acid, Z is hydrogen or an alkali metal, and n is 2 or 3.

Assignments (4)
CHANGE OF ADDRESS Recorded Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →
CHANGE OF ADDRESS Recorded Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
CHANGE OF NAME Recorded Jun 12, 2014
From: NIPPON MINING HOLDINGS, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 033091/0316 →
MERGER AND CHANGE OF NAME Recorded May 29, 2014
From: NIPPON MINING & METALS CO., LTD.; NIPPON MINING HOLDINGS INC.
To: NIPPON MINING HOLDINGS INC.
Reel/Frame 033053/0755 →