IP Library › Assignment 033091/0316
Patent Assignment
Reel/Frame 033091/0316

Change of Name

Recorded: 2014-06-12 Pages: 9
Assignor
NIPPON MINING HOLDINGS, INC.
Executed: 2010-07-01
Assignee
JX NIPPON MINING & METALS CORPORATION
6-3 OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties (18)
Metal Plating Method and Pretreatment Agent
Patent: 7,867,564 →
Application: 10/482,092 →
Publication: US 2005/0147755
Copper Electrolytic Solution and Electrolytic Copper Foil Produced Therewith
Patent: 7,777,078 →
Application: 10/531,645 →
Publication: US 2006/0166032
Method for Electroless Plating and Metal-Plated Article
Patent: 8,182,873 →
Application: 10/558,172 →
Publication: US 2006/0233963
Electroless Copper Plating Solution
Patent: 8,404,035 →
Application: 10/576,231 →
Publication: US 2007/0042125
Copper Electrolytic Solution Containing as Additive Compound Having Specific Skeleton, and Electrolytic Copper Foil Manufactured Therewith
Patent: 7,824,534 →
Application: 10/588,686 →
Publication: US 2007/0170069
Copper Electrolytic Solution Containing Quaternary Amine Compound with Specific Skeleton and Organo-Sulfur Compound as Additives, and Electrolytic Copper Foil Manufactured Using the Same
Patent: 7,771,835 →
Application: 11/586,906 →
Publication: US 2007/0042201
Resin Substrate Material, Electronic Component Substrate Material Manufactured by Electroless Plating on the Same, and Method for Manufacturing Electronic Component Substrate Material
Patent: 8,043,705 →
Application: 11/795,355 →
Publication: US 2008/0138629
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same
Patent: 8,449,751 →
Application: 11/906,663 →
Publication: US 2008/0073219
Electroless Nickel Plating Liquid
Patent: 8,182,594 →
Application: 11/920,021 →
Publication: US 2009/0064892
Two-Layer Flexible Substrate
Patent: 8,568,856 →
Application: 11/992,209 →
Publication: US 2009/0092789
Method of Surface Treatment Using Imidazole Compound
Patent: 7,968,150 →
Application: 12/290,328 →
Publication: US 2009/0068364
Plated Article Having Metal Thin Film Formed by Electroless Plating, and Manufacturing Method Thereof
Patent: 8,163,400 →
Application: 12/311,207 →
Publication: US 2010/0038111
Plated Article Having Metal Thin Film Formed by Electroless Plating
Patent: 8,394,508 →
Application: 12/311,208 →
Publication: US 2010/0003539
Electronic Component Formed with Barrier-Seed Layer on Base Material
Patent: 8,004,082 →
Application: 12/449,128 →
Publication: US 2011/0006426
Electronic Component Formed with Barrier-Seed Layer on Base Material
Patent: 8,089,154 →
Application: 12/449,162 →
Publication: US 2011/0006427
Substrate and Manufacturing Method Therefor
Patent: 8,736,057 →
Application: 12/734,560 →
Publication: US 2010/0244258
Substrate and Manufacturing Method Therefor
Patent: 8,247,301 →
Application: 12/734,590 →
Publication: US 2010/0244259
Ulsi Micro-Interconnect Member Having Ruthenium Electroplating Layer on Barrier Layer
Patent: 8,390,123 →
Application: 12/735,187 →
Publication: US 2010/0314766
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger and Change of Name May 29, 2014
From: NIPPON MINING & METALS CO., LTD.; NIPPON MINING HOLDINGS INC.
To: NIPPON MINING HOLDINGS INC.
Reel/Frame 033053/0755 →
Change of Address Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
Change of Address Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →