Metal plating method and pretreatment agent
View Patent ↗The object of the present invention is to provide a metal plating method by a simple process, for example, on resins on which plating has been heretofore impossible. The metal plating method involves surface treating an article to be plated with a liquid prepared by mixing or reacting in advance an organic acid salt of a silane coupling agent containing an azole in a molecule, for example, a coupling agent which is an equimolar reaction product of imidazole and γ-glycidoxypropyltrimethoxysilane, and a noble metal compound, and then conducting electroless plating thereon.
1. A metal plating method comprising the steps of surface-treating an article with a liquid prepared by mixing or reacting an organic acid salt of a silane coupling agent containing an azole in a molecule and a noble metal compound and then conducting electroless plating on the surface-treated article.
2. The metal plating method according to claim 1 , wherein the silane coupling agent having an azole in a molecule is obtained by a reaction of an azole compound and an epoxysilane compound.
3. The metal plating method according to claim 1 , wherein the azole is imidazole.
4. The metal plating method according to claim 1 , wherein the noble metal compound is a palladium compound.
5. The metal plating method according to claim 1 , wherein acetic acid is used to form the organic acid salt.
6. A pretreatment agent for metal plating comprising a liquid prepared by mixing or reacting an organic acid salt of a silane coupling agent containing an azole in a molecule and a noble metal compound.
7. The pretreatment agent of claim 6 , wherein acetic acid is used to form the organic acid salt.