Patent Assignment
Reel/Frame 018303/0546
Change of Name
Recorded: 2006-09-27
Received: 2006-09-27
Pages: 15
Assignor
NIKKO MATERIALS CO., LTD.
Executed: 2006-04-03
Assignee
NIPPON MINING & METALS CO., LTD.
10-1, TORANOMON 2-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Properties
(20)
Copper Electrolytic Solution Containing Amine Compound Having Specific Skeleton and Organosulfur Compound as Additives, and Electrolytic Copper Foil Produced Using the Same
Application:
11/187,282 →
Copper Electrolytic Solution and Electrolytic Copper Foil Produced Therewith
Application:
10/531,645 →
Novel imidazole alcohol compound, process for producing the same, and surface-treating agent comprising the same
Application:
10/515,708 →
Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same
Application:
10/486,861 →
Surface Treated Copper Film
Application:
10/486,274 →
Metal Plating Method, Pretreatment Agent, and Semiconductor Wafer and Semiconductor Device Obtained Using These
Application:
10/767,697 →
Metal Plating Method and Pretreatment Agent
Application:
10/482,092 →
Copper Electrolytic Solution Containing Organic Sulfur Compound and Quaternary Amine Compound of Specified Skeleton as Additives and Electrolytic Copper Foil Produced Therewith
Application:
10/480,710 →
Solid Silane Coupling Agent Composition, Process for Producing the Same, and Resin Composition Containing the Same
Application:
10/480,712 →
Copper Electrolytic Solution Containing Amine Compound Having Specific Skeleton and Organosulfur Compound as Additives, and Electrolytic Copper Foil Produced Using the Same
Application:
10/479,896 →
Electroless Plating Method and Semiconductor Wafer on Which Metal Plating Layer Is Formed
Application:
10/472,678 →
Organic Carboxylic Acid Salt Composition, Process for Preparation Thereof and Additives for Epoxy Resins
Application:
10/451,977 →
Basic Silane Coupling Agent Organic Carboxylate Composition, Method for Producing the Same, and Epoxy Resin Composition Containing the Same
Application:
10/450,421 →
Surface Treatment for Copper Foil
Application:
10/362,953 →
Pretreating Agent for Metal Plating
Application:
10/169,894 →
Water-Based Metal Surface Treatment Agent
Application:
10/169,893 →
Adhesion Accelerator for Bonding Rubber to Metal and Rubber Composition
Application:
10/166,117 →
Metal Surface Treatment Agent, and Metal Material Coated with Same
Application:
10/009,902 →
Monocarboxylate Salts of Imidazole Reaction Products, Process for Preparing the Salts, and Surface Treatments, Additives for Resins, and Resin Compositions, Containing the Same
Application:
09/936,073 →
Molybdenum Soap-Containing Metallic Soap and Method for Producing the Same
Application:
09/813,758 →