Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same
View Patent ↗The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In particular, the invention has an object of obtaining an electrolytic copper foil that can be finely patterned and have an excellent elongation and tensile strength at normal and high temperatures. This object is attained by using a copper electrolytic solution containing, as additives, an organosulfur compound, and an amine compound having a specific skeleton represented by undermentioned general formula (1) obtained by additively reacting an amine compound and a compound having one or more epoxy groups in a molecule thereof to an addition reaction. (In general formula (1), R1 and R2 are each selected from a group consisting of hydroxyalkyl groups, ether groups, aromatic groups, aromatic-substituted alkyl groups, unsaturated hydrocarbon groups, and alkyl groups, A represents an epoxy compound residue, and n represents an integer greater than or equal to 1.)
1. An electrolytic copper foil having a surface roughness Rz in a range of 0.90 to 1.20 μm, a normal-temperature tensile strength in a range of 30.5 to 37.9 kgf/mm 2 , a normal-temperature elongation in a range of 6.62 to 8.90%, a high-temperature tensile strength in a range of 20.1 to 22.3 kgf/mm 2 and a high-temperature elongation in a range of 12.1 to 18.2% and produced by using an electrolytic solution containing copper, an organosulfur compound and an amine compound having a specific skeleton represented by undermentioned general formula (1), which is synthesized by an addition reaction of an amine compound with a compound having one or more epoxy groups in a molecule thereof,
wherein R 1 and R 2 are each selected from the group consisting of hydroxyalkyl groups, ether groups, aromatic groups, aromatic-substituted alkyl groups, unsaturated hydrocarbon groups, and alkyl groups, A represents an epoxy compound residue, and n represents an integer greater than or equal to 1.
2. An electrolytic copper foil according to claim 1 , wherein the epoxy compound residue A of said amine compound having a specific skeleton has a linear ether linkage.
3. An electrolytic copper foil according to claim 1 , wherein said amine compound having the specific skeleton includes any of undermentioned general formulae (2) to (9),
n 1 is an integer from 1 to 5,
n 2 is an integer from 1 to 22,
n 3 is an integer from 1 to 3, R 1 and R 2 are each selected from the group consisting of hydroxyalkyl groups, ether groups, aromatic groups, aromatic-substituted alkyl groups, unsaturated hydrocarbon groups, and alkyl groups.
4. An electrolytic copper foil according to claim 1 , wherein said organosulfur compound is a compound represented by undermentioned general formula (10) or (11),
X—R 1 —(S) n4 —R 2 —YO 3 Z 1 (10)
R 4 —S—R 3 —SO 3 Z 2 (11)
R 1 , R 2 , and R 3 are each an alkylene group having 1 to 8 carbon atoms, R 4 is selected from the group consisting of hydrogen,
X is selected from the group consisting of hydrogen, a sulfonic acid group, a phosphonic acid group, and sulfonic acid or phosphonic acid alkali metal salt groups or ammonium salt groups, Y is sulfur or phosphorus, Z 1 and Z 2 are each hydrogen, sodium or potassium, and n 4 is 2 or 3.