Method for electroless plating and metal-plated article
View Patent ↗A method for metal plating with good adhesion to materials that are difficult to plate wherein a material to be plated is surface-treated with a silane coupling agent having in a molecule thereof a functional group with a metal-capturing capability, is heat treated at a high temperature of at least 150° C. in air or an inert gas atmosphere, surface treatment is performed with a solution containing a noble metal compound, and electroless plating is performed. Alternatively, a metal plating method is provided wherein a material to be plated is surface-treated with a liquid in which a noble metal compound and a silane coupling agent having in a molecule thereof a functional group with a metal-capturing capability have already been mixed or reacted, is heat treated at a high temperature of at least 150° C. in air or an inert gas atmosphere, and electroless plating is performed.
1. An electroless metal plating method, comprising the steps of:
reacting an azole compound with an epoxy silane compound to form a silane coupling agent having, in a molecule thereof, a functional group with a metal-capturing capability;
forming a surface-treatment liquid consisting of the silane coupling agent and a solvent and surface-treating a material with the surface-treatment liquid to obtain a surface-treated material;
heat-treating the surface-treated material at a temperature of at least 200° C. in air or an inert gas atmosphere so as to cause a structural change of the silane coupling agent and vitrification thereof to form a heat-treated material;
contacting the heat-treated material with a solution consisting of a noble metal compound and a solvent, and then
performing electroless plating on the heat-treated material to form a plated material.
2. The metal plating method according to claim 1 , wherein the functional group with a metal-capturing capability is an imidazole group.
3. The metal plating method according to claim 1 , wherein the noble metal compound is a palladium compound or a silver compound.
4. The metal plating method according to claim 1 , wherein the heat-treating step is carried out at a temperature of at least 250° C.
5. The metal plating method according to claim 1 , wherein the heat-treating step is carried out for 3 to 60 minutes.
6. An electroless metal plating method, comprising the steps of:
reacting an azole compound with an epoxy silane compound to form a silane coupling agent having, in a molecule thereof, a functional group with a metal-capturing capability;
mixing or reacting the silane coupling agent with a noble metal compound to form a surface-treatment liquid consisting of the silane coupling agent, the noble metal compound and a solvent;
surface-treating a material with the surface-treatment liquid to form a surface-treated material;
heat-treating the surface-treated material at a temperature of at least 200° C. in air or an inert gas atmosphere so as to cause a structural change of the silane coupling agent and vitrification thereof to form a heat-treated material; and then
performing electroless plating on the heat-treated material to form a plated material.
7. The metal plating method according to claim 6 , wherein the functional group with a metal-capturing capability is an imidazole group.
8. The metal plating method according to claim 6 , wherein the noble metal compound is a palladium compound or a silver compound.
9. The metal plating method according to claim 6 , wherein the heat-treating step is carried out at a temperature of at lest 250° C.
10. The metal plating method according to claim 6 , wherein the heat-treating step is carried out for 3 to 60 minutes.
11. An electroless metal plating method, comprising the steps of:
reacting an azole compound with an epoxy silane compound to form a silane coupling agent having, in a molecule thereof, a functional group with a metal-capturing capability;
forming a surface-treatment liquid consisting of the silane coupling agent and a solvent and surface-treating a material with the surface-treatment liquid to obtain a surface-treated material;
heat-treating the surface-treated material at a temperature of at least 200° C. in air or an inert gas atmosphere so as to reduce the weight of the silane coupling agent to 75% or less with respect to the weight of the silane coupling agent provided onto the material by the surface-treating to form a heat-treated material;
contacting the heat-treated material with a solution consisting of a noble metal compound and a solvent, and then
performing electroless plating on the heat-treated material to form a plated material.
12. The metal plating method according to claim 11 , wherein the heat-treating step is carried out for 3 to 60 minutes.
13. An electroless metal plating method, comprising the steps of:
reacting an azole compound with an epoxy silane compound to form a silane coupling agent having, in a molecule thereof, a functional group with a metal-capturing capability;
mixing or reacting the silane coupling agent with a noble metal compound to form a surface-treatment liquid consisting of the silane coupling agent, the noble metal compound and the solvent;
surface-treating a material with the surface-treatment liquid to form a surface-treated material;
heat-treating the surface-treated material at a temperature of at least 200° C. in air or an inert gas atmosphere so as to reduce the weight of the silane coupling agent to 75% or less with respect to the weight of the silane coupling agent provided onto the material by the surface-treating to form a heat-treated material; and then
performing electroless plating on the heat-treated material to form a plated material.
14. The metal plating method according to claim 13 , wherein the heat-treating step is carried out for 3 to 60 minutes.