IP Library Granted Patent US 7,713,340
Granted Patent B2
US 7,713,340 · App. 10/586,379 · Granted May 11, 2010

Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating

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Quick Facts
Patent No.
US 7,713,340
App. No.
10/586,379
Granted
May 11, 2010
Kind
B2
Abstract

The object of the present invention is to provide a pretreating agent for electroless plating that is stable and soluble in organic solvents, a method of electroless plating with excellent adhesiveness using it and an electroless plated product. An object to be plated is pre-treated using a pretreating agent for electroless plating comprising a noble metal soap of naphthenic acid or a fatty acid having 5 to 25 carbon atoms or preferably using a pretreating agent for electroless plating additionally comprising an imidazole silane coupling agent or other silane coupling agent having metal capturing ability, and then electroless plated. The noble metal soap is preferably a palladium soap.

Claims (12)

1. A pretreating agent for electroless plating comprising a noble metal soap of naphthenic acid or a fatty acid having 5 to 25 carbon atoms and further comprising a silane coupling agent having a functional group with metal capturing ability in the molecule.

2. The pretreating agent for electroless plating according to claim 1 , wherein the silane coupling agent is a silane coupling agent obtained by reacting an azole compound or amine compound with an epoxysilane compound.

3. The pretreating agent for electroless plating according to claim 1 , wherein the functional group with metal capturing ability is an imidazole group.

4. The pretreating agent for electroless plating according to claim 1 wherein the noble metal soap is a palladium soap.

5. The pretreating agent for electroless plating according to claim 1 , wherein the noble metal soap is palladium naphthenate, palladium neodecanate or palladium octylate.

6. An ink composition comprising the pretreating agent for electroless plating according to claim 1 .

7. The pretreating agent for electroless plating according to claim 1 , additionally comprising an organic solvent.

8. An electroless plating method comprising the step of pre-treating an object to be plated with the pretreating agent of claim 1 and then performing electroless plating of the object.

9. A plated object obtained by the electroless plating method of claim 8 .

10. An electroless plating method comprising the step of pre-treating an object to be plated with the ink composition of claim 7 and then performing electroless plating of the object.

11. The electroless plating method according to claim 10 , wherein pre-treatment of the object with the ink composition comprises drawing with an inkjet.

12. A plated object obtained by the electroless plating method of claim 10 .

Assignments (4)
CHANGE OF ADDRESS Recorded Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →
CHANGE OF ADDRESS Recorded Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
CHANGE OF NAME/MERGER Recorded Jun 9, 2011
From: NIPPON MINING & METALS CO., LTD.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 026417/0023 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2007
From: KAWAMURA, TOSHIFUMI; SUZUKI, JUN; IMORI, TORU
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 020175/0669 →