Lanthanum target for sputtering
View Patent ↗Provided are a lanthanum target for sputtering which has a Vickers hardness of 60 or more and no spotty macro patterns on the surface, and a method of producing a lanthanum target for sputtering, wherein lanthanum is melted and cast to produce an ingot, the ingot is subject to knead forging at a temperature of 300 to 500° C. and subsequently subject to upset forging at 300 to 500° C. to form the shape into a rough target shape, and this is additionally subject to machining to obtain a target. This invention aims to offer technology for efficiently and stably providing a lanthanum target for sputtering that has no spotty macro patterns on the surface, and a method of producing the same.
1. A lanthanum metal target for sputtering having a purity excluding gas components of 3N or higher, a Vickers hardness of HV60 or more, and a non-recrystallized structure with no spotty macro patterns on a surface of the target.
2. The lanthanum metal target for sputtering according to claim 1 , wherein the target consists of lanthanum metal of a purity excluding gas components of 4N or higher.
3. The lanthanum metal target for sputtering according to claim 1 , further comprising a copper-chromium alloy backing plate diffusion bonded to the lanthanum metal target.
4. A method of producing a lanthanum metal target for sputtering, wherein lanthanum is melted and cast to produce an ingot, the ingot is subject to knead forging at a temperature of 300 to 500° C. and subsequently subject to upset forging at 300 to 500° C. to form the shape into a rough target shape, and this is additionally subject to machining to obtain a target having a purity excluding gas components of 3N or higher, a Vickers hardness of HV60 or more, and a non-recrystallized structure with no spotty macro patterns on a surface of the target.