Recycling method for tantalum coil for sputtering and tantalum coil obtained by the recycling method
View Patent ↗The present invention relates to a method for recycling a tantalum coil for sputtering that is disposed between a substrate and a sputtering target. The method for recycling a tantalum coil for sputtering is characterized in that the whole or partial surface of a spent tantalum coil is subject to cutting (cutting is performed until a re-deposited film and knurling traces are eliminated) so as to eliminate the re-deposited film that was formed during sputtering, and knurling is newly performed to the cut portion. While sputtered grains are accumulated (re-deposited) on the surface of the tantalum coil disposed between the substrate and the sputtering target during sputtering, by eliminating the sputtered grains accumulated on the spent coil by way of cutting after the sputtering is complete, the tantalum coil can be efficiently recycled. Thus, provided is technology capable of lean manufacturing of new coils, improving productivity, and stably providing such coils.
1. A method for recycling a used tantalum coil of a sputtering apparatus, having a surface formed with knurling traces, wherein the surface of the used tantalum coil is cut to eliminate the knurling traces together with re-deposited films or eroded areas or both formed during sputtering on the surface of the used tantalum coil and obtain a flat and smooth surface having a surface roughness Ra of 1.6 μm or less, and thereafter the flat and smooth surface is knurled to form a new surface of the used tantalum coil provided with newly formed knurling traces.
2. The method for recycling a used tantalum coil of a sputtering apparatus according to claim 1 , wherein the surface of the used tantalum coil is cut under conditions including a cutting depth of 0.4 to 0.8 mm, a feed of 0.05 to 0.2 mm/rev, and a rotation speed of 20 to 80 rpm.
3. The method for recycling a used tantalum coil of a sputtering apparatus according to claim 2 , wherein the new surface of the used tantalum coil provided with the newly formed knurling traces has a roughness, Ra, of 15 μm or more.
4. The method for recycling a used tantalum coil of a sputtering apparatus according to claim 3 , wherein the new surface of the used tantalum coil provided with the newly formed knurling traces has a variation in thickness of 0.5 mm or less, the variation in thickness being defined as a thickness difference between a maximum thickness and a minimum thickness of the tantalum coil as recycled.
5. A recycled tantalum coil for sputtering produced by the method according to claim 4 , characterized in that the recycled tantalum coil has a surface provided with newly formed knurling traces and has a variation in thickness of 0.5 mm or less, and that the surface provided with the newly formed knurling traces has a roughness, Ra, of 15 μm or more.
6. The method for recycling a used tantalum coil of a sputtering apparatus according to claim 1 , wherein the new surface of the used tantalum coil provided with the newly formed knurling traces has a roughness, Ra, of 15 μm or more.
7. The method for recycling a used tantalum coil of a sputtering apparatus according to claim 1 , wherein the new surface of the used tantalum coil provided with the newly formed knurling traces has a variation in thickness of 0.5 mm or less, the variation in thickness being defined as a thickness difference between a maximum thickness and a minimum thickness of the tantalum coil as recycled.
8. A recycled tantalum coil for sputtering produced by the method according to claim 1 , characterized in that the recycled tantalum coil has a surface provided with newly formed knurling traces and has a variation in thickness of 0.5 mm or less, and that the surface provided with the newly formed knurling traces has a roughness, Ra, of 15 μm or more.
9. A method for recycling a used tantalum coil of a sputtering apparatus, consisting of the steps of:
cutting a surface of the used tantalum coil to eliminate a re-deposited film formed during sputtering on the surface of the used tantalum coil and until irregularities produced by the re-deposited film or an erosion part and knurling traces are eliminated and a smooth surface having a surface roughness Ra of 1.6 μm or less is obtained; and
after said cutting step, subjecting the surface to knurling to provide the surface with the surface roughness Ra of 15 μm or more;
wherein the cutting step and the knurling step have no intervening processing step therebetween.
10. The method according to claim 9 , wherein conditions for said cutting step include cutting depth of 0.4 to 0.8 mm, feed of 0.05 to 0.2 mm/rev, and rotating speed of 20 to 80 rpm.
11. The method according to claim 10 , wherein a variation in thickness of the tantalum coil, defined as a difference between maximum thickness and minimum thickness of the tantalum coil, after said knurling step is 0.5 mm or less.