Sb-Te base alloy sinter sputtering target
View Patent ↗Provided is an Sb—Te base alloy sinter sputtering target having Sb and Te as its primary component and comprising a structure in which Sb—Te base alloy particles are surrounded by fine carbon or boron particles; wherein, if the mean diameter of the Sb—Te base alloy particles is X and the particle size of carbon or boron is Y, Y/X is within the range of 1/10 to 1/10000. The present invention seeks to improve the Sb—Te base alloy sputtering target structure, inhibit the generation of cracks in the sintered target, and prevent the generation of arcing during the sputtering process.
1. An Sb—Te-based alloy sintered sputtering target, comprising Sb and Te as primary components of the sputtering target and a sintered structure in which particles of an Sb—Te-based alloy are surrounded by fine carbon or boron particles, wherein the Sb—Te-based alloy particles have a mean diameter of X, the carbon or boron particles have a mean diameter of Y, and Y/X is within the range of 1/10 to 1/10000, wherein the Sb—Te-based alloy particles consist of an Ag—In—Sb—Te alloy, and wherein a content of carbon or boron in the sputtering target is 0.1 to 10 at %.
2. The Sb—Te-based alloy sinter sputtering target according to claim 1 wherein gas atomized powder is used as the raw material of the Sb—Te-based alloy sintered compact excluding carbon or boron.
3. The Sb—Te-based alloy sinter sputtering target according to claim 2 , wherein the target contains Ag and In in an amount up to 30 at %.
4. The Sb—Te-based alloy sinter sputtering target according to claim 3 , wherein the target is used for forming a phase change recording layer formed from Ag—In—Sb—Te alloy containing carbon or boron.
5. The Sb—Te-based alloy sinter sputtering target according to claim 1 , wherein the target contains Ag, and In in an amount up to 30 at %.
6. The Sb—Te-based alloy sinter sputtering target according to claim 1 , wherein the target is used for forming a phase change recording layer formed from Ag—In—Sb—Te alloy containing carbon or boron.
7. The Sb—Te-based alloy sinter sputtering target according to claim 1 , wherein the mean diameter of the Sb—Te based alloy particles are 8 μm to 32 μm and the mean diameter of the fine carbon or boron particles is 7 nm to 750 nm.
8. The Sb—Te-based alloy sinter sputtering target according to claim 7 , wherein the mean diameter of the fine carbon or boron particles is 7 nm.
9. An Sb—Te-based alloy sintered sputtering target, comprising an Sb—Te-based alloy sintered sputtering target having Sb and Te as primary components and a structure in which Sb—Te-based alloy particles are surrounded by fine boron particles, a mean diameter of the Sb—Te-based alloy particles being X and an average particle size of the fine boron particles being Y, and Y/X being within the range of 1/10 to 1/10000, the Sb—Te-based alloy particles consisting of an Ag—In—Sb—Te alloy, and a content of boron within the sputtering target being 0.1 to 10 at %.
10. The Sb—Te-based alloy sinter sputtering target according to claim 9 , wherein the target contains Ag and In in an amount up to 30 at %.
11. The Sb—Te-based alloy sinter sputtering target according to claim 9 , wherein the Sb—Te-based alloy particles are made of Ag 5 In 5 Sb 70 Te 20 .
12. The Sb—Te-based alloy sinter sputtering target according to claim 1 , wherein the Sb—Te-based alloy particles are made of Ag 5 In 5 Sb 70 Te 20 .