Patent Assignment
Reel/Frame 025115/0675
Merger
Recorded: 2010-10-08
Pages: 10
Assignor
NIPPON MINING & METALS CO., LTD.
Executed: 2010-07-01
Assignee
NIPPON MINING HOLDINGS, INC.
10-1, TORANOMON 2-CHOME, MINATO-KU, TOKYO, 105-0001, JAPAN
Covered Properties
(51)
Copper alloy sputtering target and method for manufacturing the target
Sputtering Target Transport Box
Method for Connecting Magnetic Substance Target to Backing Plate, and Magnetic Substance Target
Electrolytic Copper Plating Method, Phosphorous Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer Having Low Particle Adhesion Plated with Said Method and Anode
Zirconium Crucible for Melting Analytical Sample, Method of Preparing Analytical Sample and Method of Analysis
Cu-Mn Alloy Sputtering Target and Semiconductor Wiring
Application:
12/300,173 →
Publication:
US 2010/0013096
Target formed of Sintering-Resistant Material of High-Melting Point Metal Alloy, High-Melting Point Metal Silicide, High-Melting Point Metal Carbide, High-Melting Point Metal Nitride, or High-Melting Point Metal Boride, Process for Producing the Target, Assembly of the Sputtering Target-Backing Plate, and Process for Producing the Same
Rolled Copper or Copper Alloy Foil with Roughened Surface and Method of Roughening Rolled Copper or Copper Alloy Foil
Sputtering Target/Backing Plate Bonded Body
Zinc Oxide Based Transparent Electric Conductor, Sputtering Target for Forming of the Conductor and Process for Producing the Target
Sb-Te Base Alloy Sinter Sputtering Target
Method for Collection of Valuable Metal from Ito Scrap
Method for Collection of Valuable Metal from Ito Scrap
Method for Collection of Valuable Metal from Ito Scrap
Method for Collection of Valuable Metal from Ito Scrap
Method for Collection of Valuable Metal from Ito Scrap
Roll Unit for Use in Surface Treatment of Copper Foil
Roll Unit Dipped in Surface Treatment Liquid
Sintered Silicon Wafer
Application:
12/522,959 →
Publication:
US 2010/0016144
Copper Anode or Phosphorous-Containing Copper Anode, Method of Electroplating Copper on Semiconductor Wafer, and Semiconductor Wafer with Low Particle Adhesion
Method of Recovering Valuable Metal from Scrap Conductive Oxide
Method of Recovering Valuable Metal from Scrap Containing Conductive Oxide
Method of Recovering Valuable Metal from Scrap Containing Conductive Oxide
Non-Adhesive-Type Flexible Laminate and Method for Production Thereof
Application:
12/525,871 →
Publication:
US 2010/0323215
Ytterbium Sputtering Target and Method of Producing said Target
Electrolytic Copper Foil for Lithium Rechargeable Battery and Process for Producing the Copper Foil
Application:
12/596,454 →
Publication:
US 2010/0136434
Sputtering Target and Manufacturing Method Thereof
Amorphous Film of Composite Oxide, Crystalline Film of Composite Oxide, Method of Producing Said Films and Sintered Compact of Composite Oxide
Spherical Copper Fine Powder and Process for Producing the Same
Application:
12/666,864 →
Publication:
US 2010/0192728
Sintered Compact of Composite Oxide, Amorphous Film of Composite Oxide, Process for Producing Said Film, Crystalline Film of Composite Oxide and Process for Producing Said Film
Sintered Silicon Wafer
Application:
12/668,239 →
Publication:
US 2010/0330325
Sintered Silicon Wafer
Application:
12/668,307 →
Publication:
US 2010/0187661
Method of Producing Sintered Compact, Sintered Compact, Sputtering Target Formed from the same, and Sputtering Target-Backing Plate Assembly
Application:
12/676,767 →
Publication:
US 2010/0206724
Copper Foil for Printed Circuit and Copper-Clad Laminate
Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite
Application:
12/738,095 →
Publication:
US 2010/0215982
Metal Covered Polyimide Composite, Process for Producing the Composite, and Process for Producing Electronic Circuit Board
Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit Board
High Purity Ytterbium, Sputtering Target Made Thereof, Thin Film Containing the Same, and Method of Producing the Same
Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic Material
Thin Film Mainly Comprising Titanium Oxide, Sintered Sputtering Target Suitable for Producing Thin Film Mainly Comprising Titanium Oxide, and Method of Producing Thin Film Mainly Comprising Titanium Oxide
Application:
12/808,469 →
Publication:
US 2010/0276276
Method of Producing Two-Layered Copper-Clad Laminate, and Two-Layered Copper-Clad Laminate
High-Purity Lanthanum, Sputtering Target Comprising High-Purity Lanthanum, and Metal Gate Film Mainly Comprising High-Purity Lanthanum
Hybrid Silicon Wafer and Method of Producing the Same
Hybrid Silicon Wafer and Method of Producing the Same
Electrolytic Copper Plating Method, Pure Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer Having Low Particle Adhesion Plated with Said Method and Anode
Method of Recovering Valuable Metals from Izo Scrap
Method of Recovering Valuable Metals from Izo Scrap
Method of Recovering Valuable Metals from Izo Scrap
Sintered Oxide Compact Target for Sputtering and Process for Producing the same
Non-Adhesive Flexible Laminate
Application:
12/865,885 →
Publication:
US 2011/0003169
Sintered Compact Target and Method of Producing Sintered Compact
Application:
12/922,485 →
Publication:
US 2011/0017590
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 12, 2005
From: OKABE, TAKEO; MIYASHITA, HIROHITO
To: NIKKO MATERIALS COMPANY, LIMITED
Reel/Frame 015588/0751 →
Assignment of Assignor's Interest
Jan 24, 2005
From: NEMOTO, FUMIYA; INOUE, ATSUSHI
To: NIKKO MATERIALS COMPANY, LIMITED
Reel/Frame 015618/0488 →
Change of Name
Nov 28, 2006
From: NIKKO MATERIALS CO., LTD.
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 018555/0221 →
Change of Name
Nov 28, 2006
From: NIKKO MATERIALS CO., LTD.
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 018557/0853 →
Change of Name
Feb 5, 2008
From: NIKKO MATERIALS, CO., LTD.
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 020453/0826 →
Assignment of Assignor's Interest
Feb 5, 2008
From: YAMAKOSHI, YASUHIRO; MOGAKI, KENICHI
To: NIKKO MATERIALS CO., LTD.
Reel/Frame 020447/0742 →
Assignment of Assignor's Interest
Mar 4, 2008
From: AIBA, AKIHIRO; OKABE, TAKEO
To: NIKKO MATERIALS CO., LTD.
Reel/Frame 020595/0825 →
Change of Name
Mar 5, 2008
From: NIKKO MATERIALS CO., LTD.
To: NIPPON MINING & METALS CO., LTD
Reel/Frame 020604/0455 →
Assignment of Assignor's Interest
Oct 21, 2008
From: SAKAGUCHI, MASAHIRO; YAMAGUCHI, MITSURU; TAKAHASHI, TOMIO; TAKEMOTO, KOUICHI
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 021704/0294 →
Assignment of Assignor's Interest
Nov 11, 2008
From: IRUMATA, SHUICHI; MIYATA, CHISAKA
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 021818/0815 →
Assignment of Assignor's Interest
Nov 26, 2008
From: YAMAKOSHI, YASUHIRO
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 021902/0162 →
Assignment of Assignor's Interest
Dec 30, 2008
From: ODA, KUNIHIRO; FUKUSHIMA, ATSUSHI
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 022051/0334 →
Assignment of Assignor's Interest
Jan 6, 2009
From: IKISAWA, MASAKATSU; YAHAGI, MASATAKA
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 022067/0541 →
Assignment of Assignor's Interest
Jan 6, 2009
From: KOBAYASHI, YOUSUKE; MIKI, ATSUSHI; YAMANISHI, KEISUKE
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 022067/0386 →
Assignment of Assignor's Interest
Apr 13, 2009
From: SHINDO, YUICHIRO; TAKEMOTO, KOUICHI
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 022517/0891 →
Assignment of Assignor's Interest
Apr 14, 2009
From: SHINDO, YUICHIRO; TAKEMOTO, KOUICHI
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 022524/0566 →
Assignment of Assignor's Interest
Apr 16, 2009
From: SHINDO, YUICHIRO; TAKEMOTO, KOUICHI
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 022547/0029 →
Assignment of Assignor's Interest
Apr 16, 2009
From: SHINDO, YUICHIRO; TAKEMOTO, KOUICHI
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 022546/0428 →
Assignment of Assignor's Interest
Apr 16, 2009
From: SHINDO, YUICHIRO; TAKEMOTO, KOUICHI
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 022563/0840 →
Assignment of Assignor's Interest
Apr 22, 2009
From: YAHAGI, MASATAKA; TAKAHASHI, HIDEYUKI; AJIMA, HIROHISA
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 022579/0424 →
Assignment of Assignor's Interest
Jun 26, 2009
From: SATO, HARUO
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 022884/0976 →
Change of Name
Oct 12, 2010
From: NIPPON MINING HOLDINGS, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 025123/0420 →
Change of Address
Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
Change of Address
Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →
Change of Address
Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057453/0937 →