Ytterbium sputtering target and method of producing said target
View Patent ↗Provided is a method of producing an ytterbium sputtering target, wherein an ytterbium target material having Vickers hardness (Hv) of the material surface of 15 or more and 40 or less is prepared in advance, and a surface of the ytterbium target material having the foregoing surface hardness is subject to final finish processing by way of machining. With the ytterbium sputtering target, present invention aims to remarkably reduce the irregularities (gouges) on the target surface after the final finish processing of the target material, and to inhibit the generation of particles during sputtering.
1. A method of producing an ytterbium sputtering target, wherein, in advance of final finish processing, an ytterbium material for forming the ytterbium sputtering target is processed such that a surface of the ytterbium material is provided with a Vickers hardness (Hv) of 15 or more and 40 or less, and thereafter the surface of the ytterbium material is subjected to the final finish processing by machining.
2. A method according to claim 1 , wherein the ytterbium material for forming the ytterbium sputtering target is processed such that Vickers hardness (Hv) measured at a location under the surface of the ytterbium material is −3 or more and 5 or less relative to the Vickers hardness of the surface of the ytterbium material.
3. A method according to claim 1 , wherein an ytterbium cast ingot is subjected to cold rolling to form a rolled sheet, thereafter the rolled sheet is annealed in a vacuum or an inert gas at 350° C. or higher and 700° C. or lower, and a surface of the annealed sheet is subjected to the final finish processing by machining.
4. A method according to claim 1 , wherein the ytterbium material consists of ytterbium and unavoidable impurities, and wherein the ytterbium material has a purity of 3N or higher.
5. A method according to claim 1 , wherein the ytterbium material consists of ytterbium and unavoidable impurities, and wherein the ytterbium material has a purity of 4N or higher.
6. A method according to claim 1 , wherein dry cutting work is performed in the final finish processing.
7. A method of producing an ytterbium sputtering target, wherein, in advance of final finish processing, an ytterbium material for forming the ytterbium sputtering target is processed such that a surface of the ytterbium material is provided with a Vickers hardness (Hv) of 18 or more and 40 or less, and thereafter the surface of the ytterbium material is subjected to the final finish processing by machining.
8. A method of producing an ytterbium sputtering target according to claim 7 , wherein the ytterbium material for forming the ytterbium sputtering target is processed such that Vickers hardness (Hv) measured at a location under the surface of the ytterbium material is −3 or more and 5 or less relative to the Vickers hardness of the surface of the ytterbium material.
9. A method of producing an ytterbium sputtering target according to claim 8 , wherein an ytterbium cast ingot is subjected to cold rolling to form a rolled sheet, thereafter the rolled sheet is annealed in a vacuum or an inert gas at 350° C. or higher and 700° C. or lower, and a surface of the annealed sheet is subjected to the final finish processing by machining.
10. A method of producing an ytterbium sputtering target according to claim 9 , wherein the ytterbium material consists of ytterbium and unavoidable impurities, and wherein the ytterbium material has a purity of 3N or higher.
11. A method of producing an ytterbium sputtering target according to claim 9 , wherein the ytterbium material consists of ytterbium and unavoidable impurities, and wherein the ytterbium material has a purity of 4N or higher.
12. A method of producing an ytterbium sputtering target according to claim 9 , wherein dry cutting work is performed in the final finish processing.
13. A method according to claim 7 , wherein dry cutting work is performed in the final finish processing.