Patent Assignment
Reel/Frame 020595/0825
Assignment of Assignor's Interest
Recorded: 2008-03-04
Pages: 3
Assignee
NIKKO MATERIALS CO., LTD.
10-1, TORANOMON 2-CHOME, MINATO-KU, TOKYO, 105-8407, JAPAN
Covered Property
(1)
Electrolytic Copper Plating Method, Phosphorous Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer Having Low Particle Adhesion Plated with Said Method and Anode
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 5, 2008
From: NIKKO MATERIALS CO., LTD.
To: NIPPON MINING & METALS CO., LTD
Reel/Frame 020604/0455 →
Merger
Oct 8, 2010
From: NIPPON MINING & METALS CO., LTD.
To: NIPPON MINING HOLDINGS, INC.
Reel/Frame 025115/0675 →
Change of Name
Oct 12, 2010
From: NIPPON MINING HOLDINGS, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 025123/0420 →
Change of Address
Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
Change of Address
Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →