Copper foil having blackened surface or layer
View Patent ↗A copper foil with a blackened surface or layer wherein one or both surfaces of a copper foil is subject to black treatment, and having a color difference ΔL*≦−70 and chroma C*≦15 of a black-treated surface when measured by a color difference meter represented by black; ΔL*=−100, white; ΔL*=0. The copper foil with a blackened surface or layer is especially useful for a plasma display panel (PDP) and has superior shielding characteristics of effectively shielding electromagnetic waves, near infrared rays, stray light, outside light and the like, has sufficient contrast, has a deep blackened color, is able to limit the reflected light of incoming light from the outside and reflected light of outgoing light from a plasma display panel, and has superior etching characteristics.
1. A copper foil with a blackened layer formed on one or both surfaces thereof, said blackened layer of said copper foil having a color difference ΔL*≦−70 and chroma C*≦15 when measured by a color difference meter represented by black, ΔL*=−100, and white, ΔL*=0, and said blackened layer of said copper foil having coarsened grains of 1 μm or less and surface roughness Ra of 0.5 μm or less, Rt of 4.0 μm or less, and Rz of 3.5 μm or less.
2. A copper foil with blackened layer according to claim 1 , wherein said blackened layer is an electro-plated coating of at least one of Co, Ni—Cu, Co—Cu and Ni—Co—Cu.
3. A copper foil with blackened layer according to claim 2 , wherein said blackened layer is an Ni-Cu electro-plated coating and an Ni mass of deposit per unit area in the Ni—Cu plating is 200 to 1000 mg/m 2 .
4. A copper foil with blackened layer according to claim 2 , wherein said blackened layer is an Ni-Cu electro-plated coating and Ni+Co mass of deposit per unit area in the Ni—Co—Cu plating is 130 to 1000 mg/m 2 .
5. A copper foil with blackened layer according to claim 2 , wherein said blackened layer is an Ni-Cu electro-plated coating and a Co mass of deposit per unit area in the Co—Cu plating is 300 to 1000 mg/m 2 .
6. A copper foil with blackened layer according to claim 2 , wherein said blackened layer is an Ni-Cu electro-plated coating and a Co mass of deposit per unit area in the Co plating is 1000 to 5000 mg/m 2 .
7. A copper foil with blackened layer according to claim 1 , wherein the copper foil is an electrolytic copper foil or a rolled copper foil of 8 to 18 μm.
8. A copper foil with blackened layer according to claim 1 , further comprising a rust prevention layer on said blackened layer.
9. A copper foil with blackened layer according to claim 8 , wherein said rust prevention layer is of at least one of Cr, Zn, Zn—Ni, and Zn—Ni—P.
10. A copper foil with blackened layer according to claim 1 , wherein said copper foil is a plasma display copper foil.
11. A copper foil wit blackened layer according to claim 1 , wherein said blackened layer is an Ni—Cu electro-plated coating that is coated witb a layer of a Ni or Ni—Co electro-plated coating, and wherein an Ni+Co mass of deposit per unit area of a surface subject to the Ni or Ni—Co plating, after the Ni—Cu plating, is 250 to 1500 mg/m 2 .
12. A copper foil with blackened layer according to claim 1 , wherein said blackened layer is an Ni—Co—Cu electro-plated coating that is coated with a layer of a Ni or Ni—Co electro-plated coating, and wherein an Ni+Co mass of deposit per unit area of a plated surface subject to the Ni or Ni—Co plating, after the Ni—Co—Cu plating, is 250 to 1500 mg/m 2 .
13. A copper foil with blackened layer according to claim 1 , wherein said blackened layer is a Co—Cu electro-plated coating that is coated with a layer of a Ni or Ni—Co electro-plated coating, and wherein an Ni+Co mass of deposit per unit area of a plated surface subject to the Ni or Ni—Co plating, after the Co—Cu plating, is 350 to 1500mg/m 2 .
14. A copper foil with blackened layer according to claim 1 , wherein said blackened layer is a Co electro-plated coating that is coated with a layer of a Ni or Ni—Co electro-plated coating, and wherein an Ni+Co mass of deposit per unit area of a plated surface subject to Ni or Ni—Co plating, after the Co plating, is 1050 to 2000mg/m 2 .
15. A copper foil with blackened layer according to claim 1 , wherein the blackened layer has a glossiness ≦15.
16. A copper foil with blackened layer according to claim 15 , wherein said blackened layer is an electro-plated coating of at least one of Co, Ni—Cu, Co—Cu and Ni—Co—Cu.
17. A copper foil with blackened layer according to claim 16 , wherein said blackened layer is an Ni-Cu electro-plated coating and an Ni mass of deposit per unit area in the Ni—Cu plating is 200 to 1000 mg/m 2 .
18. A copper foil with blackened layer according to claim 16 , wherein said blackened layer is an Ni-Cu electro-plated coating and Ni+Co mass of deposit per unit area in the Ni—Co—Cu plating is 130 to 1000 mg/m 2 ,
19. A copper foil with blackened layer according to claim 16 , wherein said blackened layer is an Ni-Cu electro-plated coating and a Co mass of deposit per unit area in the Co—Cu plating is 300 to 1000 mg/m 2 ,
20. A copper foil with blackened layer according to claim 16 , wherein said blackened layer is an Ni-Cu electro-plated coating and a Co mass of deposit per unit area in the Co plating is 1000 to 5000 mg/m 2 .
21. A copper foil with blackened layer according to claim 16 , wherein the copper foil is an electrolytic copper foil or a rolled copper foil of a thickness of 8 to 18 μm.
22. A copper foil with blackened layer according to claim 21 , further comprising a rust prevention layer on said blackened layer.
23. A copper foil with blackened layer according to claim 22 , wherein said rust prevention layer is of at least one of Cr, Zn, Zn—Ni, and Zn—Ni—P.
24. A copper foil with blackened layer according to claim 23 , wherein said copper foil is a plasma display copper foil.