Cu—Co—Ni—Si alloy for electronic components
The present invention provides a Cu—Co—Ni—Si alloy for an electronic component having improved reliability in which in addition to high strength and high electrical conduction, bendability generally difficult to achieve with strength is also provided to a Corson copper alloy. The present invention is a Cu—Co—Ni—Si alloy for an electronic component comprising 0.5 to 3.0% by mass of Co and 0.1 to 1.0% by mass of Ni, a concentration (% by mass) ratio of Ni to Co (Ni/Co) being adjusted in the range of 0.1 to 1.0, the alloy comprising Si so that a (Co+Ni)/Si mass ratio is in the range of 3 to 5, and comprising a balance comprising Cu and unavoidable impurities, wherein a coefficient of variation of concentration ratios of Co to Ni (Co/Ni) measured for at least 100 second-phase particles is 20% or less.
1. A Cu—Co—Ni—Si alloy for an electronic component comprising:
0.5 to 3.0% by mass of Co and 0.1 to 1.0% by mass of Ni, wherein the ratio of the concentration (% by mass) of Ni to Co (Ni/Co) is in the range of 0.1 to 1.0,
Si so that the (Co+Ni)/Si mass ratio of the alloy is in the range of 3 to 5, the balance of the alloy comprising Cu and unavoidable impurities, and optionally up to 1.0% by mass, in total, of at least one selected from the group consisting of Fe, Mg, Sn, Zn, B, P, Cr, Zr, Ti, Al, and Mn,
wherein a coefficient of variation of concentration ratios of Co to Ni (Co/Ni) measured for at least 100 second-phase particles is 20% or less.
2. The alloy according to claim 1 , comprising up to 1.0% by mass, in total, of at least one selected from the group consisting of Fe, Mg, Sn, Zn, B, P, Cr, Zr, Ti, Al, and Mn.
3. The alloy according to claim 1 , wherein an average of number of second-phase particles having a particle size of 5 to 30 nm is 3.0×10 8 /mm 2 or more.
4. The alloy according to claim 1 , comprising a 0.2% proof stress of 650 MPa or more in a direction parallel to a rolling direction and comprising an electrical conductivity of 50% IACS or more.
5. The alloy according to claim 1 , wherein an average roughness Ra of a surface of a bent portion of the alloy is 1.0 μm or less as determined by a W bending test performed with a bending axis in the same direction as the rolling direction and a bending radius (R)/sheet thickness (t) of 1.0.
6. An electronic component comprising the alloy according to claim 1 .