IP Library Granted Patent US 10,194,534
Granted Patent B2
US 10,194,534 · App. 15/654,801 · Granted Jan 29, 2019

Printed wiring board, electronic device, catheter, and metallic material

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Quick Facts
Patent No.
US 10,194,534
App. No.
15/654,801
Granted
Jan 29, 2019
Kind
B2
Abstract

Provided herein is a printed wiring board that can desirably dissipate the heat of a heat-generating component. The printed wiring board includes one or more wires, and one or more heat-generating components. The one or more wires include a rolled copper foil, either partly or as a whole. The one or more heat-generating components and the one or more wires are directly or indirectly connected to each other.

Claims (31)

1. A printed wiring board comprising:

one or more wires; and

one or more heat-generating components,

wherein the one or more wires satisfy, either partly or as a whole, at least one of the following conditions (A) to (C):

(A) the one or more wires include a rolled copper foil, either partly or as a whole,

(B) the one or more wires include, either partly or as a whole, a material having a thermal conductivity of 330 W/(m·K) or more, and

(C) the one or more wires include, either partly or as a whole, a material having an electrical conductivity of 88% IACS or more, and

wherein the one or more heat-generating components and the one or more wires are directly or indirectly connected to each other.

2. A printed wiring board comprising:

one or more wires; and

one or more heat-generating components,

wherein the one or more heat-generating components and the one or more wires are directly or indirectly connected to each other, and

wherein the one or more wires are provided with a plurality of extraction wires that is adapted to discharge heat of the heat-generating components from the printed wiring board.

3. The printed wiring board according to claim 1 , wherein one of the one or more heat-generating components, more than one of the one or more heat-generating components, or all of the one or more heat-generating components are light-emitting components.

4. The printed wiring board according to claim 2 , wherein one of the one or more heat-generating components, more than one of the one or more heat-generating components, or all of the one or more heat-generating components are light-emitting components.

5. The printed wiring board according to claim 1 , wherein one of the one or more heat-generating components, more than one of the one or more heat-generating components, or all of the one or more heat-generating components have a heat quantity of 0.5 mW or more per component in terms of a quantity of heat that generates upon passing electricity.

6. The printed wiring board according to claim 1 , wherein at least one of the one or more wires has a length of 17 mm or more.

7. The printed wiring board according to claim 6 , wherein the one or more heat-generating components are directly or indirectly connected to the wire having a length or 17 mm or more.

8. The printed wiring board according to claim 1 , wherein the one or more wires are configured from, either partly or as a whole, a metal having a maximum crystal grain size of 5.0 μm or more in a cross section taken parallel to a thickness direction of the wire.

9. The printed wiring board according to claim 2 , wherein the one or more wires are configured from, either partly or as a whole, a metal having a maximum crystal grain size of 5.0 μm or more in a cross section taken parallel to a thickness direction of the wire.

10. The printed wiring board according to claim 3 , wherein the one or more wires are configured from, either partly or as a whole, a metal having a maximum crystal grain size of 5.0 μm or more in a cross section taken parallel to a thickness direction of the wire.

11. The printed wiring board according to claim 4 , wherein the one or more wires are configured from, either partly or as a whole, a metal having a maximum crystal grain size of 5.0 μm or more in a cross section taken parallel to a thickness direction of the wire.

12. The printed wiring board according to claim 1 , wherein one of the heat-generating components, more than one of the heat-generating components, or all of the heat-generating components comprise at least one selected from the group consisting of light emitting diodes, laser semiconductors, laser-generating devices, camera modules, antennas, and communication devices.

13. An electronic device comprising the printed wiring board of claim 1 .

14. An electronic device comprising the printed wiring board of claim 2 .

15. An electronic device comprising the printed wiring board of claim 8 .

16. An electronic device comprising the printed wiring board of claim 9 .

17. A catheter comprising the printed wiring board of claim 1 .

18. A catheter comprising the printed wiring board of claim 2 .

19. A catheter comprising the printed wiring board of claim 3 .

20. A catheter comprising the printed wiring board of claim 4 .

Assignments (2)
CHANGE OF ADDRESS Recorded Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2017
From: ARAI, HIDETA; MIKI, ATSUSHI; MORIOKA, SATORU
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 043738/0420 →