Tantalum sputtering target and method of manufacturing same
View Patent ↗Provided is a tantalum sputtering target manufactured by working a molten and cast tantalum ingot or billet through forging, annealing and rolling, wherein the structure of the tantalum target comprises a non-recrystallized structure. The tantalum sputtering target having a high deposition speed and excellent uniformity of film, producing less arcings and particles and having excellent film forming properties, and the method capable of stably manufacturing the target can be provided by improving and devising plastic working steps such as forging and rolling, and the heat treatment step.
1. A tantalum sputtering target manufactured by subjecting a molten and cast tantalum ingot or billet to forging, annealing and rolling, said tantalum sputtering target having a non-recrystallized structure, wherein the non-recrystallized structure is 20% or more.
2. A tantalum sputtering target according to claim 1 , wherein the non-recrystallized structure is more than 20%.
3. A tantalum sputtering target according to claim 1 , wherein said tantalum sputtering target has a Vickers hardness of 90 or more.
4. A tantalum sputtering target according to claim 1 , wherein said tantalum sputtering target is made of high purity tantalum having a purity of 4N5 (99.995%) or more.
5. A tantalum sputtering target manufactured by subjecting a molten and cast tantalum ingot or billet to forging, annealing and rolling, said tantalum sputtering target having a non-recrystallized structure, wherein the non-recrystallized structure is 40% or more.
6. A tantalum sputtering target according to claim 3 , wherein said tantalum sputtering target has a Vickers hardness of 90 or more.
7. A tantalum sputtering target according to claim 5 , wherein said tantalum sputtering target has a Vickers hardness of 100 or more.
8. A tantalum sputtering target according to claim 5 , wherein said tantalum sputtering target has a Vickers hardness of 125 or more.
9. A method of manufacturing a tantalum sputtering target comprising the steps of subjecting a molten and cast tantalum ingot or billet to forging, annealing and rolling processes, and performing plastic working on said ingot or billet, and thereafter annealing the ingot or billet at a temperature of 1173K or less to provide the tantalum sputtering target with a non-recrystallized structure.
10. The method according to claim 9 , wherein said ingot or billet is subjected to finish processing to form a target shape.
11. The method according to claim 9 , wherein, during said step of subjecting the molten and cast tantalum ingot or billet to forging, annealing and rolling processes, the annealing is recrystallization annealing, and wherein said forging and recrystallization annealing processes are repeated two or more times.
12. The method according to claim 9 , wherein extend forging and upset forging are repeatedly performed on the ingot or billet.
13. The method according to claim 9 , wherein, during said step of subjecting the molten and cast tantalum ingot or billet to forging, annealing and rolling processes, the annealing is recrystallization annealing, and wherein said recrystallization annealing is performed at a temperature of between a recrystallization temperature of the ingot or billet and 1673K.
14. A method of manufacturing a tantalum sputtering target comprising the steps of subjecting a molten and cast tantalum ingot or billet made of a tantalum raw material having a purity of 4N5 (99.995%) or more to forging, annealing and rolling, performing a plastic working process on the ingot or billet, and thereafter annealing the ingot or billet at a temperature of 1173K or less to provide the tantalum sputtering target with a non-recrystallized structure.
15. The method according to claim 14 , wherein, after said plastic working process or after said step of annealing at 1173K or less, said ingot or billet is subjected to finish processing to form a target shape.
16. The method according to claim 15 , wherein during said step of subjecting the molten and cast tantalum ingot or billet to forging, annealing and rolling, said annealing is recrystallization annealing, and said forging and recrystallization annealing processes are repeated two or more times.
17. The method according to claim 16 , wherein extend forging and upset forging are repeatedly performed on the ingot or billet.
18. The method according to claim 17 , wherein said recrystallization annealing is performed at a temperature of between a recrystallization temperature of the ingot or billet and 1673K.
19. The method according to claim 14 , wherein during said step of subjecting the molten and cast tantalum ingot or billet to forging, annealing and rolling, said annealing is recrystallization annealing, and said forging and recrystallization annealing processes are repeated two or more times.
20. The method according to claim 14 , wherein extend forging and upset forging are repeatedly performed on the ingot or billet.
21. The method according to claim 14 , wherein during said step of subjecting the molten and cast tantalum ingot or billet to forging, annealing and rolling, said annealing is recrystallization annealing performed at a temperature of between a recrystallization temperature of the ingot or billet and 1673K.
22. The method according to claim 14 , wherein said temperature is selected from the group consisting of 973K, 1048K, and 1073K.
23. The method according to claim 14 , wherein said temperature is 973K to 1073K.