Target of high-purity nickel or nickel alloy and its producing method
View Patent ↗Provided is high purity nickel or nickel alloy target for magnetron sputtering having superior sputtering film uniformity and in which the magnetic permeability of the target is 100 or more, and this high purity nickel or a nickel alloy target for magnetron sputtering capable of achieving a favorable film uniformity (evenness of film thickness) and superior in plasma ignition (firing) even during the manufacturing process employing a 300 mm wafer. The present invention also provides the manufacturing method of such high purity nickel or nickel alloy target.
1. A sputtering target for magnetron sputtering, comprising:
a nickel alloy sputtering target consisting essentially of nickel and an alloy element, said alloy element being selected from a group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Co, Pt, Pd, Ir, Fe and Mn, a content of said alloy element within said nickel alloy of said target being 0.5 to 7 at % with the remainder 93 to 99.5 at % being nickel;
said target having a thickness of 5 mm or less, a magnetic permeability of 100 or more, an average crystal grain size within said target of 20 to 1200 μm, and an even metallographic structure without coarse crystal grains that are fivefold or more in growth from said average crystal grain size; and
said nickel alloy of said target having a purity of 5N (99.999 wt %) or more.
2. A sputtering target according to claim 1 , wherein said thickness of said target is 3 mm.
3. A sputtering target according to claim 1 , wherein said target has an erosion face that has an average crystal grain size within a coefficient of variation of 20% from said average crystal grain size within said target.
4. A sputtering target according to claim 1 , wherein said sputtering target has a sputtering face, and wherein said magnetic permeability of 100 or more is in a direction parallel to said sputtering face.
5. A sputtering target according to claim 1 , wherein said alloy element is selected from a group consisting of Zr, Hf, Co, Pt, Pd, Ir, Fe and Mn.
6. A sputtering target for magnetron sputtering, comprising:
a nickel alloy sputtering target having a discoid-shape defining a sputtering face and being of a thickness of 5mm or less and a predetermined diameter;
said nickel alloy sputtering target consisting essentially of 93 to 99.5 at % nickel and 0.5 to 7 at % of an alloy element, said alloy element being selected from a group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Co, Pt, Pd, Ir, Fe and Mn;
said target having a magnetic permeability in a direction parallel to said sputtering face of 100 or more, an average crystal grain size of 20 to 1200 μm, and an even metallographic structure without coarse crystal grains that are fivefold or more in growth from said average crystal grain size; and
said nickel alloy of said target having a purity of 5N (99.999 wt %) or more.
7. A sputtering target according to claim 6 , wherein said thickness is 3 mm.
8. A sputtering target according to claim 7 , wherein said predetermined diameter is 440 mm.
9. A sputtering target according to claim 6 , wherein said allay element is selected from a group consisting of Zr, Hf, Co, Pt, Pd, Ir, Fe and Mn.
10. A sputtering target for magnetron sputtering, comprising:
a nickel alloy sputtering target having a sputtering face;
said nickel alloy sputtering target consisting of nickel and 0.5 to 7 at % of an alloy element selected from the group consisting of Zr, Hf, Co, Pt, Pd, Ir, Fe and Mn; and
said target having a magnetic permeability in a direction parallel to said sputtering face of 100 or more, an average crystal grain size of 20 to 1200 μm, and an even metallographic structure without coarse crystal grains that are fivefold or more in growth from said average crystal grain size.
11. A sputtering target according to claim 10 , wherein said nickel alloy of said target has a purity of 5N (99.999 wt %) or more.
12. A sputtering target according to claim 11 , wherein said target has a thickness of 3 mm.