Nonmagnetic material particle dispersed ferromagnetic material sputtering target
View Patent ↗Provided is a nonmagnetic material particle dispersed ferromagnetic material sputtering target comprising a material including nonmagnetic material particles dispersed in a ferromagnetic material. The nonmagnetic material particle dispersed ferromagnetic material sputtering target is characterized in that all particles of the nonmagnetic material with a structure observed on the material in its polished face have a shape and size that are smaller than all imaginary circles having a radius of 2 μm formed around an arbitrary point within the nonmagnetic material particles, or that have at least two contact points or intersection points between the imaginary circles and the interface of the ferromagnetic material and the nonmagnetic material. The nonmagnetic material particle dispersed ferromagnetic material sputtering target is advantageous in that, in the formation of a film by sputtering, the influence of heating or the like on a substrate can be reduced, high-speed deposition by DC sputtering is possible, the film thickness can be regulated to be thin, the generation of particles (dust) or nodules can be reduced during sputtering, the variation in quality can be reduced to improve the mass productivity, fine crystal grains and high density can be realized, and the nonmagnetic material particle dispersed ferromagnetic material sputtering target is particularly best suited for use as a magnetic recording layer.
1. A sputtering target of a ferromagnetic material containing a dispersion of particles of a nonmagnetic material and capable of use in DC magnetron sputtering, comprising a sintered compact sputtering target consisting of the ferromagnetic material and the dispersed particles of the nonmagnetic material, the nonmagnetic material being one or more materials selected from a group consisting of an oxide, nitride, carbide, and silicide, wherein each of the particles of the nonmagnetic material existing in a microstructure on a polished face of the sputtering target has a size that cannot encompass any imaginary circle which has a radius of 2 μm and which has a center at an arbitrary point within a periphery of the particle, or alternatively a size such that the imaginary circle has at least two contact points or intersection points with the periphery of the particle, and wherein, in the microstructure on the polished face of the sputtering target, a largest diameter of diameters of areas containing no particles of the nonmagnetic material is 40 μm or less.
2. A sputtering target according to claim 1 , wherein the imaginary circle has a radius of 1 μm.
3. A sputtering target according claim 2 , wherein, in the microstructure on the polished face of the sputtering target, the number of said areas containing no particles of nonmagnetic material having a diameter of 10 to 40 μm is 1000 areas/mm 2 or less.
4. A sputtering target according to claim 3 , wherein the ferromagnetic material is a material having Co and/or Fe as its main component.
5. A sputtering target according to claim 4 , wherein the nonmagnetic material is composed of at least one metallic oxide which is not reduced or decomposed by heating in the presence of metallic Co or metallic Cr or the mixture or alloy thereof in a vacuum or inert atmosphere.
6. A sputtering target according to claim 5 , wherein the metallic oxide is an oxide of a metal selected from a group consisting of Cr, Ta, V, Si, Ce, Ti, Zr, Al, Mg, and Nb.
7. A sputtering target according claim 1 , wherein, in the microstructure on the polished face of the sputtering target, the number of areas containing no particles of nonmagnetic material having a diameter of 10 to 40 μm is 1000 areas/mm 2 or less.
8. A sputtering target according to claim 7 , wherein the ferromagnetic material is a material having Co and/or Fe as its main component.
9. A sputtering target according to claim 8 , wherein the nonmagnetic material is composed of at least one metallic oxide which is not reduced or decomposed by heating in the presence of metallic Co or metallic Cr or the mixture or alloy thereof in a vacuum or inert atmosphere.
10. A sputtering target according to claim 9 , wherein the metallic oxide is an oxide of a metal selected from a group consisting of Cr, Ta, V, Si, Ce, Ti, Zr, Al, Mg, and Nb.
11. A sputtering target according to claim 1 , wherein the ferromagnetic material is a material having Co and/or Fe as its main component.
12. A sputtering target according to claim 11 , wherein the nonmagnetic material is composed of at least one metallic oxide which is not reduced or decomposed by heating in the presence of metallic Co or metallic Cr or the mixture or alloy thereof in a vacuum or inert atmosphere.
13. A sputtering target according to claim 1 , wherein the nonmagnetic material is composed of at least one metallic oxide which is not reduced or decomposed by heating in the presence of metallic Co or metallic Cr or the mixture or alloy thereof in a vacuum or inert atmosphere.
14. A sputtering target according to claim 13 , wherein the metallic oxide is an oxide of a metal selected from a group consisting of Cr, Ta, V, Si, Ce, Ti, Zr, Al, Mg, and Nb.
15. A sputtering target according to claim 1 , wherein the nonmagnetic material is selected from the group consisting of a nitride, carbide, and silicide.
16. A sputtering target according to claim 1 , wherein the nonmagnetic material is selected from the group consisting of a nitride, and carbide.
17. A sputtering target according to claim 1 , wherein the ferromagnetic material is a material having Fe as its main component.