Ni-plated copper or copper alloy material, connector terminal, connector and electronic component using the same
View Patent ↗The present invention provides a Ni-plated copper or copper alloy material having both excellent hardness and excellent bendability. In the Ni-plated copper or copper alloy material having, an area ratio of a crystal having <001> plane orientation in a crystal plane parallel to a surface of a Ni plating, measured by an electron backscatter diffraction, is 15 to 35%.
1. A Ni-plated copper or copper alloy material, wherein an area ratio of a crystal having <001> plane orientation in a crystal plane parallel to a surface of a Ni plating, measured by an electron backscatter diffraction, is 15 to 35%.
2. The Ni-plated copper or copper alloy material according to claim 1 , wherein the area ratio of the crystal having <001> plane orientation in the crystal plane parallel to the surface of the Ni plating is 15 to 20%.
3. The Ni-plated copper or copper alloy material according to claim 1 , wherein an ultrafine indentation hardness of the surface of the Ni plating is 4500N/mm 2 or more.
4. The Ni-plated copper or copper alloy material according to claim 3 , wherein the ultrafine indentation hardness of the surface of the Ni plating is 4800N/mm 2 or more.
5. A connector terminal comprising a contact part consisting of the Ni-plated copper or copper alloy material according to claim 1 .
6. An FFC terminal comprising a contact part consisting of the Ni-plated copper or copper alloy material according to claim 1 .
7. An FPC terminal comprising a contact part consisting of the Ni-plated copper or copper alloy material according to claim 1 .
8. An electronic component comprising an external connecting electrode consisting of the Ni-plated copper or copper alloy material according to claim 1 .
9. An electronic component comprising
a mounting portion to be attached to a housing, wherein a female terminal connection portion and a board connection portion are provided respectively on one side and the other side of a mounting portion, and
a push-in type terminal for fixing the board connection portion to a board by pushing the board connection portion into a through hole formed in the board, wherein the push-in type terminal consists of the Ni-plated copper or copper alloy material according to claim 1 .